SHINKAWA ACB35 WIRE BOND
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shinkawa acb35 wire bond division: semiconductor equipment | condition info: good | number of units: 1
operation console ws-7505bu
automatic handling of 100mm - 200mm wafers
8nm (0.008 micron) maximum resolution (at 1kv accelerating voltage)
tfe emmitter electron optics
100x - 200,000x magnification...
flexible batch cleaning system. wash chamber accommodates up to 12 in. x 12 in. x 12 in. parts basket. heated spray under immersion wash cycle. heated open spray rinse cycle. open loop final rinse....
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