- United States
- $19,500 USD
- Tokyo Seimitsu
Vertical Slicing Machine with ID Diamond Blade. Electronically controlled slicing machine produces quality wafers by precisely cutting an ingot of brittle materials with an ID diamond blade. Blade size OD: 422 mm, ID: 152 mm. Acceptable Ingot Size: Max. 100 mm x 350 mm L. Includes oil mist separator. 220V, 3 Ph, 60 Hz.
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