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Semiconductor Equipment Corp. 410 52745 in Freehold Township, NJ, USA

Location:
Freehold Township, NJ, USA
Price:
$29,000 (USD)
Model:
410

Specifications

Condition:
used
Stock number:
52745
Category:
Machine Tools equipment in United States
Subcategory:
Bonders - welders

Description

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size: 0.010 to 1.000 in. sq.