- Freehold Township, NJ, USA
- $25,000 (USD)
- K & S semiconductor equipment
- 7100 AD
Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.
Get email updates for K & S 7100 AD