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tape frame applicator with camera and monitor for alignment. vacuum hold down of wafers up to 6 in. dia. roller applies pressure to tape frame to remove bubbles and help with adhesion.
dispenser, bohdan automation, model awspd
a94770 asm assembly automation ad809s die bonder condition: for parts or not working
finetech fineplacer micro die bonder fineplacer micro die bonder mfg: finetech condition: used a2v.h micro with thales z12 zoom 1x tube ap2.2 placement arm with fine theta rotation ac3led coaxial illumination for...
mydata tp9-2 component placement systemunit in great shape. sold as-is... i have no idea how to test.we will build a custom pallet for thi ...
macro-defectinspection-tool location: dresden serial number(s): 207 macro-defectinspection-tool