Top Seller
Hypervision Chip Unzip 48882 in
Location:
Freehold Township, NJ
Price:
$3,500 USD
Manufacturer:
Hypervision
Model:
Chip Unzip

Specifications

Condition:
used
Stock number:
48882
Subcategory:
Bonders - welders

Description

Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.