- Freehold Township, NJ, USA
- $3,500 (USD)
- Chip Unzip
- Stock number:
- Machine Tools equipment in United States
- Bonders - welders
Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.
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