- Freehold Township, NJ, USA
- LEDA-8F 3G Plus-V 110
3G Plus-V is a wafer prober for testing diced die on stretch frame (dies on blue tape mounted on a tape ring). Wafers cut, broken by scribing, laser etc. and then expanded on stretch frame. May be tested to determine if any secondary operations have damaged the product. The maximum test area for the system is 6 inches of active die area or smaller. Machine Features: 3G Plus-V provides the functions of die position information saving, auto-probing, testing etc. It contains these advantages: * Automatic diced wafer alignment. * Rapid pre-scan provides fast die position information speeding test and increasing throughput. Probe station for testing LED light emitting diodes. Compact rigid and reliable semiautomatic chip probing system. PC controller. 5 in. dia. vacuum chuck. Four precision probe manipulators. StereoZoom microscope. WEI Industries Co. Ltd model LED-632HC LED tester. This controller tested for power only, not LED testing. 110V, 50/60 Hz.
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