- Freehold Township, NJ, USA
Bump Measurement Profiling System. The right inspection tool for flip-chip process control. Repeatably measures solder bump heights, from 150 micro-meters or more for standard flip-chip bumps down to a few microns for under-bump metalization pads, as well as provides volume data on all bump sizes. Non-contact 3-D data on all size bumps over the entire wafer. The system calculates bump height, width, volume and coplanarity. Automatically detects bump position, solder bridges, and missing and extra solder bumps, with prominent display of pass/fail results and position statistics at the bump, die,wafer and lot level. Powerful measurement analysis, generating output as 2-D cross sections, contour plots, bearing ratio plots, or 3-D images. A built in Wizard allows quick measurement set-up.
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