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this was removed from a decommissioned system and not tested separately.
oxide process module for nano-ald system. process module only, no pumps. 300mm. sold not tested with 30 day right to return.
rudolph technologies fe-iii configuration: boots up application: thin films
c101213 mti manufacturing technology inc. nsx-180 wafer dicing saw condition: for parts or not working
system purchased new in 2012 only used for 50 hours. improvements to our fab process led to higher wafer yields and the need for this sytsem has ... read more
the main function of this system is to rapidly anneal semiconductor substrates using laser beam energy in order to recover defect crystals generated by pre-process such as ion implantation.the syst...