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Location:
Regensburg, Germany
Manufacturer:
EVG
Model:
EVG850TB/200
Number of Units:
1

Specifications

Condition:
used
Year:
2005
Accessories:
high pressure cleaning added in 2006
Missing parts:
doors, some little parts
Condition info:
Good
Number of units:
1
Cassette to cassette:
YES
Wafer size range; maximum:
150 mm
Wafer size range; minimum:
150 mm
Wafer size range; set size:
150 mm

Description

Waferbonder for 6 inch wafers
missing parts: doors, some little parts