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precision wafer dicing saw. monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck ...
this mti manufacturing technology inc. nsx-180 wafer dicing saw [p/n 90-10000-00; 208vac, 3ph (5-wire), 15/30a, 50/60hz; mfd. 2/00) looks to be in decent cosmetic condition, showing some signs of w...
evg850db/200 wafer debonder for 150mm wafers waferdebonder
lot numer 525333
this was removed from a decommissioned robot and not tested under power. the hands both move easily in and out from their home positions, and the rotation is very smooth and easy.
template tencor prometrix ft-700 wafer film thickness measurement system (ft-750?) ... read more