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precision wafer dicing saw. monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck ...
this mti manufacturing technology inc. nsx-180 wafer dicing saw [p/n 90-10000-00; 208vac, 3ph (5-wire), 15/30a, 50/60hz; mfd. 2/00) looks to be in decent cosmetic condition, showing some signs of w...
evg850db/200 wafer debonder for 150mm wafers waferdebonder
lot numer 525331
this was removed from a decommissioned robot and not tested under power. the hands both move easily in and out from their home positions, and the rotation is very smooth and easy.
priced $6,495.00 kulicke soffa kns k&s 6900 flip chip bonder bonding machine internal part number 11025 predecessor to: n/a condition ... read more