• 1993 Meyer Burger TS 206

    • Manufacturer: Meyer

      this saw is designed to wafer to cut especially in the semiconductor industry. it can be used for other hard and brittle materials such as ceramic, quartz glass and magnetic materials. -siemens panel saw blade 34...

      No price
      Obermaßfeld-Grimmenthal, Germany
    • 1980 Meyer Burger TS 23

      • Manufacturer: Meyer

        this saw is designed to cut wafers in the semiconductor industry. it can be used for other hard and brittle materials such as ceramic, quartz glass and magnetic materials. control of meyer burger -no table availa...

        No price
        Obermaßfeld-Grimmenthal, Germany
      • 1988 Meyer Burger TS 23

        • Manufacturer: Meyer

          this saw is dеsigned to cut wafers in the semiconductor industry. it can be used for other hard and brittle materials such as ceramic, quartz glass and magnetic materials. control of meyer burger saw blade 27 " a...

          No price
          Obermaßfeld-Grimmenthal, Germany
        • No price
          Brügg, Switzerland
        • No price
          Brügg, Switzerland
        • No price
          Brügg, Switzerland
        • 1999 MEYER&BURGER(CH) BS 800

          • Manufacturer: BS-vognen

            precision-bandsaw for silicon (solar industry) working area: 760x760x400mm | workpiece-ø (mm): 400

            No price
            Metzingen, Germany
          • No price
            Brügg, Switzerland