• 1993 Meyer Burger TS 206

    No price - Obermaßfeld-Grimmenthal, Germany
    • Manufacturer: Meyer

    this saw is designed to wafer to cut especially in the semiconductor industry. it can be used for other hard and brittle materials such as ceramic, quartz glass and magnetic materials. -siemens pan...

  • 1980 Meyer Burger TS 23

    No price - Obermaßfeld-Grimmenthal, Germany
    • Manufacturer: Meyer

    this saw is designed to cut wafers in the semiconductor industry. it can be used for other hard and brittle materials such as ceramic, quartz glass and magnetic materials. control of meyer burger -...

  • 1988 Meyer Burger TS 23

    No price - Obermaßfeld-Grimmenthal, Germany
    • Manufacturer: Meyer

    this saw is designed to cut wafers in the semiconductor industry. it can be used for other hard and brittle materials such as ceramic, quartz glass and magnetic materials. control of meyer burger s...

  • MEYER BURGER TS 23 Cutting-off machine #19166

    No price - Brügg, Switzerland
    • Manufacturer: Meyer
  • MEYER BURGER BS 805 Band saw for hard and brittle materials #19167

    No price - Brügg, Switzerland
    • Manufacturer: BS-vognen
  • 1999 MEYER&BURGER(CH) BS 800

    No price - Metzingen, Germany
    • Manufacturer: BS-vognen

    precision-bandsaw for silicon (solar industry) working area: 760x760x400mm | workpiece-ø (mm): 400

  • MEYER BURGER TS 121 Cutting-off machine #19585

    No price - Brügg, Switzerland
    • Manufacturer: Meyer