• 1998 Shinkawa UTC-300BI Wire Bonder

    No price - Ibaraki Prefecture, Japan
    • Manufacturer: Shinkawa

    bonding method: ultrasonic thermocompression bonding method accuracy:±4μm bonding wire length: max 7mm bonding aria:x40y50 wire diameter:φ20‾38μm

  • 1999 Shinkawa UTC-300BI Wire Bonder

    No price - Ibaraki Prefecture, Japan
    • Manufacturer: Shinkawa

    bonding type: ultrasonic thermocompression bonding type machine accuracy:±4μm bonding wire length: max 7mm bonding area: x40*y50 wire diameter:φ20~38μm

  • 1997 Shinkawa ACB35

    No price - Regensburg, Germany
    • Manufacturer: Shinkawa
    • Number of Units: 1

    shinkawa acb35 wire bond division: semiconductor equipment | condition info: good | number of units: 1

  • 2000 Shinkawa ACB35

    No price - Regensburg, Germany
    • Manufacturer: Shinkawa
    • Number of Units: 1

    shinkawa acb35 wire bond division: semiconductor equipment | condition info: good | number of units: 1

  • 2001 Shinkawa ACB35

    No price - Regensburg, Germany
    • Manufacturer: Shinkawa
    • Number of Units: 1

    shinkawa acb35 wire bond note: specially featured | division: semiconductor equipment | condition info: good | number of units: 1

  • 2010 Shinkawa UTC-300

    No price - Tokyo, Japan
    • Manufacturer: Shinkawa

    wire bonder qty: 28

  • 2006 Shinkawa SPA-300

    No price - Tokyo, Japan
    • Manufacturer: Shinkawa

    die bonder qty: 12

  • Shinkawa US-45

    No price - Tokyo, Japan
    • Manufacturer: Shinkawa

    wire bonder qty: 1

  • 2003 Shinkawa ACB-35

    No price - Tokyo, Japan
    • Manufacturer: Shinkawa

    wire bonder qty: 3

  • 2004 Shinkawa SBB-410

    No price - Tokyo, Japan
    • Manufacturer: Shinkawa

    bump bonder qty: 1