• 1998 Shinkawa UTC-300BI Wire Bonder

    No price - Ibaraki Prefecture, Japan
    • Manufacturer: Shinkawa

    bonding method: ultrasonic thermocompression bonding method accuracy:±4μm bonding wire length: max 7mm bonding aria:x40y50 wire diameter:φ20‾38μm

  • 2003 Shinkawa ACB 400 Wire Bonder ACB400

    No price - Bavaria, Germany
    • Manufacturer: FAIR
    • Number of Units: 3

    to bond wire on the chip in strip to strips form wire bonder machine

  • 1997 Shinkawa ACB35

    No price - Regensburg, Germany
    • Manufacturer: Shinkawa
    • Number of Units: 1

    shinkawa acb35 wire bond division: semiconductor equipment | condition info: good | number of units: 1

  • 2000 Shinkawa ACB35

    No price - Regensburg, Germany
    • Manufacturer: Shinkawa
    • Number of Units: 1

    shinkawa acb35 wire bond division: semiconductor equipment | condition info: good | number of units: 1

  • 2001 Shinkawa ACB35

    No price - Regensburg, Germany
    • Manufacturer: Shinkawa
    • Number of Units: 1

    shinkawa acb35 wire bond notes: f* | division: semiconductor equipment | condition info: good | number of units: 1