Used shinkawa

- 9 listings found
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  • 1998 Shinkawa UTC-300 BI

    • Manufacturer: Shinkawa

      Bonding method: ultrasonic thermocompression bonding method, machine accuracy: ± 4 μm, bonding wire length: maximum 7 mm, bonding area: x 40 mm y 50 mm, wire diameter: φ 20 to 38 μm

      No price
      Tokyo, Japan
    • 1999 Shinkawa UTC-300 BI

      • Manufacturer: Shinkawa

        Bonding method: ultrasonic thermocompression bonding method, machine accuracy: ± 4 μm, bonding wire length: maximum 7 mm, bonding area: x 40 mm y 50 mm, wire diameter: φ 20 to 38 μm

        No price
        Tokyo, Japan
      • 1997 Shinkawa ACB35

        • Manufacturer: Shinkawa
        • Number of Units: 1

        Shinkawa acb35 wire bond division: semiconductor equipment | condition info: good | number of units: 1

        No price
        Regensburg, Germany
      • 2000 Shinkawa ACB35

        • Manufacturer: Shinkawa
        • Number of Units: 1

        Shinkawa acb35 wire bond division: semiconductor equipment | condition info: good | number of units: 1

        No price
        Regensburg, Germany
      • 2001 Shinkawa ACB35

        • Manufacturer: Shinkawa
        • Number of Units: 1

        Shinkawa acb35 wire bond notes: f* | division: semiconductor equipment | condition info: good | number of units: 1

        No price
        Regensburg, Germany
      • 2010 Shinkawa ACB 1000 Wire Bonder ACB1000

        • Manufacturer: Shinkawa
        • Number of Units: 5

        To bond wire on the chip in strip to strips form wire bonder machine

        No price
        Malacca, Malaysia
      • 2003 Shinkawa ACB 400 Wire Bonder ACB400

        • Manufacturer: FAIR
        • Number of Units: 3

        To bond wire on the chip in strip to strips form wire bonder machine

        No price
        Malacca, Malaysia
      • Shinkawa UTC 1000 Wire Bonder

            Price is only a placeholder. please contact us for pricing

            $8,000 (USD)
            Tustin, CA, USA