Manufacturer

Used Semiconductor Equipment in Malaysia

- 16 listings found
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  • 2008 tosok DBD4600VRS Die Bonder DBD4600

    • Manufacturer: tosok
    • Number of Units: 1

    To bond chip from wafer into strip to strips form die bonder machine

    No price
    Malacca, Malaysia
  • 2010 Shinkawa ACB 1000 Wire Bonder ACB1000

    • Manufacturer: Shinkawa
    • Number of Units: 5

    To bond wire on the chip in strip to strips form wire bonder machine

    No price
    Malacca, Malaysia
  • 2005 DISCO CORPORATION DFD 670 Dicer DFD670, SM06

    • Manufacturer: FAIR
    • Number of Units: 1

    Wafer sawing for 12" wafer dicer machine notes: n* | weight: 4,740 lb (2,150 kg) | condition info: fair | number of units: 1 | exterior dimensions; depth: 61.024 in (155.0 cm) | exterior dimensions; width: 47.244...

    No price
    Malacca, Malaysia
  • 2008 THA Germany THA Taper ETAP014

    • Manufacturer: THA Germany
    • Number of Units: 1

    Tsxp taping machine notes: n* | weight: 1,764 lb (800 kg) | condition info: good | number of units: 1 | exterior dimensions; depth: 43.307 in (110.0 cm) | exterior dimensions; width: 49.213 in (125.0 cm) | exteri...

    No price
    Malacca, Malaysia
  • 2003 Diener Diener Tetra 30-LF-PC Plasma Clean Machine

    • Manufacturer: Diener
    • Number of Units: 1

    Location: malacca plasma clean machine notes: n* | weight: 882 lb (400 kg) | condition info: good | number of units: 1 | shipping weight: lb kg | power requirements: 230 v 1 phase | exterior dimensions; depth: 33...

    No price
    Malacca, Malaysia
  • 2015 Kynergy No Detaper Machine

    • Manufacturer: Kynergy
    • Number of Units: 1

    Location: malacca detaper machine notes: f*n* | weight: 3,307 lb (1,500 kg) | condition info: like new | number of units: 1 | shipping weight: lb kg | power requirements: 200-240 v 1 phase | exterior dimensions; ...

    No price
    Malacca, Malaysia
  • 2003 Manufacturing Integr MIT_LH100TTL Laser Mark Machine

    • Manufacturer: FAIR
    • Number of Units: 1

    Location: malacca laser mark machine notes: n* | weight: 3,307 lb (1,500 kg) | condition info: fair | number of units: 1 | shipping weight: lb kg | power requirements: other v 3 phase | exterior dimensions; depth...

    No price
    Malacca, Malaysia
  • 2006 Manufacturing Integr MIT_LH100SP Laser Mark Machine

    • Manufacturer: FAIR
    • Number of Units: 1

    Location: malacca laser mark machine notes: n* | weight: 3,307 lb (1,500 kg) | condition info: fair | number of units: 1 | shipping weight: lb kg | power requirements: other v 3 phase | exterior dimensions; depth...

    No price
    Malacca, Malaysia
  • 2003 Shinkawa ACB 400 Wire Bonder ACB400

    • Manufacturer: FAIR
    • Number of Units: 3

    To bond wire on the chip in strip to strips form wire bonder machine

    No price
    Malacca, Malaysia
  • 2007 Sikama International M:Falcon 8500 Curing Oven Sikama & Wet Clean

    • Manufacturer: International
    • Number of Units: 1

    Curing oven sikama m:falcon 8500 & wet clean notes: n* | weight: 1,102 lb (500 kg) | condition info: good | number of units: 1 | shipping weight: lb kg | curing oven sikama m: falcon 8500 & wet clean | exterior d...

    No price
    Malacca, Malaysia