Semiconductors » Wafer Slicing / Dicing » Japan

Search By Manufacturer

Search By Prefecture

Building Filters

Related Events

Live Now

Make Offer | Automated Assembly Equipment From Dexcom

by AllSurplus

Online
Ends Jan 31st, 14:00 CST
View event
6

Used Wafer Slicing / Dicing in Japan

  • no-image_en.png

    LGR-Series

    • Manufacturer: TOWA JAPAN

    Enables high-precision blade cutting of lead-less device products such as QFN packages. Selectable blade cut(FMS3040-HC) or laser cut(LGR1040) depending on process and lead frame design. Combining dedicated lead ...

    Kyoto, Japan
  • no-image_en.png

    TSK A-WD-100A

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-100A

    Manufacturing process: assembly

    Tokyo, Japan
  • no-image_en.png

    2008 TSK A-WD-10B

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-10B

    Manufacturing process: assembly | Inch: 6

    Tokyo, Japan
  • no-image_en.png

    2008 TSK A-WD-10B

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-10B

    Manufacturing process: assembly | Inch: 6

    Tokyo, Japan
  • no-image_en.png

    TSK A-WD-100A

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-100A

    Manufacturing process: assembly

    Tokyo, Japan
  • no-image_en.png

    2000 JEOL JWS-7555S

    • Manufacturer: Jeol

    Manufacturing process: examination | Inch: 8

    Tokyo, Japan