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FC300: The High Force and High Accuracy Die Bonder for Large Devices
The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The tool features automated hand...
Singapore
Hwacheon M1-5AX
- Manufacturer: Hwacheon
- Model: M1-5AX
- Control: Fanuc 31i-B5 Plus
High-Precision 5-Axis Machining Center with Ø300 Table M1-5AX is equipped with an acceleration/deceleration conveyance system design optimized for a minimal cycle time and has a structure that allows an easy acce...
Singapore