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New Die Bonders

  • Submicron Semi-Auto Eutectic Die Bonder

    Submicron Semi-Auto Eutectic Die Bonder RYW-ETB05B

      Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

      Guangzhou, China
    • Manual Epoxy and Eutectic Die

      Manual Epoxy and Eutectic Die Bonder

        MDSJHYZPGJ0225 Epoxy and Eutectic Die Bonder 1. Effective solution without touching the surface of the chip Clamp edge collapse problem 2. Automatic scribing, dispensing, sticking, automatic rebound height detec...

        Guangzhou, China
      • Dual head high speed Die

        Dual head high speed Die Bonder

          MDAX64DI-25-3 Planar Dual head high-speed Die Bonder Applicable to SMD2020 1010 2121 2835 5730, filament, etc 一、Model characteristics 1. Independent double head die bonding, double stamp arm, double wafer search ...

          Guangzhou, China
        • MDAX-FC810 flip chip die bonder

          MDAX-FC810 flip chip die bonder

            MDAX-FC810 flip chip die bonder This model is a fixed crystal mount machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging flip chips A...

            Guangzhou, China
          • MD-JC360-D Syringe type die bonder

            MD-JC360-D Syringe type die bonder

              Guangzhou, China
            • Automatic die sorter

              Automatic die sorter

              • Manufacturer: Minder Hightech

              Guangzhou, China
            • MDDB-LA838 Die attach

              MDDB-LA838 Die attach

              • Manufacturer: Minder Hightech

              Equipment specifications Control specifications

              Guangzhou, China
            • MD-DDM08 die demounter

              MD-DDM08 die demounter

              • Manufacturer: Minder Hightech

              Product features： 1. Suitable for wafer peeling process of 8 inches and below; 2. Adopting non-contact film stripping to prevent damage to grains and improve product qualification rate; 3. Simple and convenient o...

              Guangzhou, China
            • Film to Film Die Sorter

              Film to Film Die Sorter MDAX-DS380F

              • Manufacturer: Minder Hightech

              1， Support 12-8 inch wafer input and 12-8 inch wafter output. (support customize wafer sizes) 2， Support multiple die sizes(0.3-25mm). need conversion kits) 3， With strong mapping function. As well as BIN functio...

              Guangzhou, China
            • IGUS 117.1.12PZ

              IGUS 117.1.12PZ

              • Manufacturer: Igus

              Manufacturer IGUS Type of cable accessories bracket Manufacturer series B17/B17i Version rigid Cable accessories application : cable chain

              $4 USD
              Manama, Bahrain
            • E42037060AC JUKI UPPER COVER 16MM

              E42037060AC JUKI UPPER COVER 16MM ASM

              • Manufacturer: Juki

              Shenzhen, China
            • Panasonic MTKB000485AA Working head

              Panasonic MTKB000485AA Working head

              • Manufacturer: Panasonic

              Shenzhen, China
            • Panasonic NPM-D3 MTPA044817AA PLATE

              Panasonic NPM-D3 MTPA044817AA PLATE

              • Manufacturer: Panasonic

              Shenzhen, China
            • Panasonic NPM-D3 N210103005AB PLATE

              Panasonic NPM-D3 N210103005AB PLATE

              • Manufacturer: Panasonic

              Shenzhen, China
            • Universal AI 44906901 Switch, Pb

              Universal AI 44906901 Switch, Pb Mom

              • Manufacturer: Yinuo

              Shenzhen, China
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