New Die Bonders

Panasonic NOZZLE 240CN N610119499AB

• Manufacturer: Panasonic

Automatic die bonder manual upload and down load

Md-jc360: 8inch wafer die bonder manual upload and dowload. | Md-jc380: 12inch wafer die bonder manual upload and download

Manual Epoxy die bonder

Features: 1. It can realize the function of automatic scribing of various patterns such as single-point dispensing, rectangle, rice character, etc. 2. Realize the soft contact of the suction nozzle, effectively s...

Automatic die bonder automatic upload and download

Automatic die bonder automatic upload and download MD-JC360i MD-JC380i

MD-BT104 multifunctional pull tester for IC die bond wire bond

MD-BT104 multifunctional pull tester application area Semiconductor packaging TO series packaging LED packaging IGBT packaging Microelectronic packaging MD-BT104 The multifunctional push-pull testing machine is w...

FC150: The Most Flexible High Accuracy Die Bonder

FC300: The High Force and High Accuracy Die Bonder for Large Devices

The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The tool features automated hand...

ACCµRA Plus: Dedicated to production for Optoelectronic and Silicon photonics applications

The ACCµRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes. ACCμRA Plus combines high precision, flexibility and short c...

High precision die bonder MD-1412

This die bonder is high precision die bonder use for high requirment die bonding, it first picking die by swing to a holder, which can calibrate the angle, and then re-pick to the leadframe by linear guide.