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Used systeme

  • Trusted Seller
    2019 ASM AD 838L Die

    2019 ASM AD 838L Die Bonder

    • Manufacturer: ASM
    • Model: AD838

    Can be set up for dotting or dispense epoxy Two systems available

    ASIA
  • Trusted Seller
    2003 ASM AD-8912 Die Bonder

    2003 ASM AD-8912 Die Bonder

    • Manufacturer: ASM

     Wafer Diameter Maximum 12" (300 mm)  Wafer XY Table Travel (13” x 13”) 334 x 334mm  Die Size (10 x 10 mil to 1000 x 1000 mil)  Die Placement Accuracy XY (0.38 mil)8.38um  Epoxy Fillet Height (<2/3 of di...

    Asia
  • Trusted Seller
    2004 ASM AD-8912 Die Bonder

    2004 ASM AD-8912 Die Bonder

    • Manufacturer: ASM

     Wafer Diameter Maximum 12" (300 mm)  Wafer XY Table Travel (13” x 13”) 334 x 334mm  Die Size (10 x 10 mil to 1000 x 1000 mil)  Die Placement Accuracy XY (0.38 mil)8.38um  Epoxy Fillet Height (<2/3 of di...

    Asia
  • Trusted Seller
    2013 ASM AD838

    2013 ASM AD838

    • Manufacturer: ASM
    • Model: AD838

    Magazine and stack loader input Magazine output 8 Inch wafer table and expansion unit Dispensing system Rotary Bond Head

    Asia
  • ASM AD830

    ASM AD830

    • Manufacturer: ASM
    • Model: AD830

    This manual is to provide trained engineer or technician with the AD830 die bonder interediate setup and servicing instruction. includes: ●Bond quality problem and solution, grease information and setup tools use...

    Suzhou, China