Semiconductors » Assembly / Packaging (semiconductors)

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  • Disco DFD-2S/8

    Disco DFD-2S/8

    • Manufacturer: Disco
    • Model: DFD2S/8

    Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Direct Drive | Stroke: 650mm Max | Effective cut stroke: 220mm | Cut speed: 0.7~3000mm/sec | Max programmable stroke: 220mm | Index speed: 3...

    South Korea
  • Disco DFD-3D/8

    Disco DFD-3D/8

    • Manufacturer: Disco
    • Model: DFD3D/8

    Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Servo Motor-Direct Drive | Minimum stroke: 652mm (25.7") (end to end) | Set-up cut stroke: 200mm(8.7") | Cut speed: 0.7~3000mm/sec (0.0028 t...

    South Korea
  • Trusted Seller
    Disco DFD-2S/8 Fully Automatic Dicing

    Disco DFD-2S/8 Fully Automatic Dicing Saw

    • Manufacturer: Disco
    • Model: DFD2S/8

    Status: excellent Application: Dicing/Cutting/Slotting various wafers ◆ X - axis Section Drive Method: AC Servo Motor Stroke: 650mm Max Effective Cut Stroke: 220mm Cut Speed: 0.7~3000mm/sec ◆ Y - axis Sect...

    Asia
  • Trusted Seller
    Disco DFD-3D/8 Fully Automatic Dicing

    Disco DFD-3D/8 Fully Automatic Dicing Saw

    • Manufacturer: Disco
    • Model: DFD3D/8

    Status: excellent Application: Dicing/Cutting/Slotting various wafers ◆ X - axis Section Drive Method: AC Servo Motor-ball Screw Minimum Stroke: 652mm (25.7") (end to end) Set-up Cut Stroke: 220mm (8.7") Cu...

    Asia

Overview

Assembly and packaging equipment for semiconductors covers machines used to turn wafers and dies into finished, tested components. This includes die attach, wire bonders, flip-chip bonders, encapsulation, wafer-level packaging, and final test/inspection tools. These systems demand cleanroom compatibility, precise alignment, controlled environments, and traceable process data to meet yield and reliability targets in microelectronics manufacturing.

FAQ

What should I check when buying used semiconductor assembly/packaging equipment?

Verify maintenance and calibration records, cycle counts, contamination history, software/firmware versions and licenses, compatibility with your wafer/die sizes, and availability of spare parts and qualified service.

How should sensitive packaging tools be shipped?

Use specialized freight with ESD protection, clean covers, desiccants, and shock mitigation. Secure moving parts, drain/process fluids if required, and plan requalification and cleaning after delivery.

What routine maintenance keeps these machines reliable?

Follow OEM preventive schedules: replace filters and vacuum pump oil, check optics and alignments, update firmware, maintain tool calibration, and stock critical spares with a service contract if possible.