Semiconductors » Assembly / Packaging (semiconductors)

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Used sensor

  • Trusted Seller
    1999 Disco DAD341

    1999 Disco DAD341

    • Manufacturer: Disco
    • Model: DAD341

    DAD341 with 2.2kw spd (uses 3" blades), NCS, single objective lens, spindle cooling flow sensor, new monitor, used 8" chuck table.

    United States
  • Trusted Seller
    Disco DFD6361 wafer dicing saw

    Disco DFD6361 wafer dicing saw 300mm

    • Manufacturer: Disco
    • Model: DFD6361

    Disco DFD6361 Wafer Dicing Saw Configuration: Touch Screen Display with GUI interface Standard 1.2 kW Spindles x2 Automatic Wheel Covers and Sensors Dual Cameras for simultaneous Z1/Z2 kerf check plus Hi-Lo Mag A...

    Bree, Ireland
  • Trusted Seller
    DISCO DFD6361 DICING SAW

    DISCO DFD6361 DICING SAW

    • Manufacturer: Disco
    • Model: DFD6361

    Disco DFD6361 *Touch Screen Display GUI interface *Standard 1.2kW spindle(2) *Automatic wheel covers and sensors *Dual cameras for simultaneous Z1/Z2 kerf check plus HiLo Mag *Auto all system condition monitor *A...

    Bree, Ireland
  • Trusted Seller
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    Disco Hi-Tec DFD650

    • Manufacturer: Disco
    • Model: DFD650

    Disco Hi-Tec DFD650 Wafer Dicing Saw EQUIPMENT DETAILS: Tool is running in test clean room. Missing 2 parts below. -Operation manual -Electric drawing 2 Modified parts below. -CSP Cut Soft -Spinner part 1, Casset...

    Bree, Ireland

Overview

Assembly and packaging equipment for semiconductors covers machines used to turn wafers and dies into finished, tested components. This includes die attach, wire bonders, flip-chip bonders, encapsulation, wafer-level packaging, and final test/inspection tools. These systems demand cleanroom compatibility, precise alignment, controlled environments, and traceable process data to meet yield and reliability targets in microelectronics manufacturing.

FAQ

What should I check when buying used semiconductor assembly/packaging equipment?

Verify maintenance and calibration records, cycle counts, contamination history, software/firmware versions and licenses, compatibility with your wafer/die sizes, and availability of spare parts and qualified service.

How should sensitive packaging tools be shipped?

Use specialized freight with ESD protection, clean covers, desiccants, and shock mitigation. Secure moving parts, drain/process fluids if required, and plan requalification and cleaning after delivery.

What routine maintenance keeps these machines reliable?

Follow OEM preventive schedules: replace filters and vacuum pump oil, check optics and alignments, update firmware, maintain tool calibration, and stock critical spares with a service contract if possible.