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- Trusted Seller
EVG 501 Wafer Bonder
- Manufacturer: EVG
- Model: 501
150mm As-is or refurb - Model: EVG 501 - Capable of thermo compression, fusion or anodic wafer bonding - Bond chamber for small pieces up to 150mm wafers (with correct tooling) - Thickness: Max wafer stack t...
United States - Trusted Seller
Bond Aligner EVG 520
- Manufacturer: EVG
- Model: 520
-Tooling for 6" Wafer inclusive Bond Chuck and Pressure Insert -Capable of fusion compression bonding -Capable of thermal compression bonding -Capable of anodic bonding -Ideal for R&D and pilot production app...
Europe 
2000 EVG 520
- Manufacturer: EVG
- Model: 520
Vintage 2000 Manual wafer load substrate bonder Capable of fusion compression bonding Capable of thermal compression bonding Ideal for R&D and pilot production applications High-vacuum capable bond chamber Auto o...
Ashford, United Kingdom
EVG 501
- Manufacturer: EVG
- Model: 501
Refurbishment, warranty, installation, training, service and support available Available for full inspection and demonstration Manual wafer load substrate bonder Capable of fusion compression bonding Capable of t...
Ashford, United Kingdom