Building Filters
TPC-2110
It is a fully automated CMP polishing equipment for thin films (dielectric layers), which is used for the flattening and polishing of oxides, metals, STIs, SOIs, MEMS and other products. The equipment is compatib...
Beijing, China
TMP-200S
This series of equipment is suitable for CMP polishing equipment for thin films (dielectric layers), including oxide, metal, STI, SOI, MEMS and other products of planarization polishing. It adopts multi-partition...
Beijing, China
TPP-1310
Manually put the carrier plate onto the loading and unloading table, put the carrier plate onto the upper polishing disk through the loading and unloading table, and then carry out automatic polishing, the machin...
Beijing, China
JL-S12 (12 inches) Single-Sided Lapping and Polishing Machine
With global demand increasing in the semiconductor industry, the new JL-S12 single-sided lapping/polishing machine utilises CMP (chemical mechanical polishing), over traditional lapping to reduce the surface roug...
Taichung, Taiwan