• Finetech Fineplacer Micro Die Bonder

    • Manufacturer: Finetech

      finetech fineplacer micro die bonder fineplacer micro die bonder mfg: finetech condition: used a2v.h micro with thales z12 zoom 1x tube ap2.2 placement arm with fine theta rotation ac3led coaxial illumination for...

      $36,325
      United States
    • Tosko DBD-7000 Die Bonder

          price is only a placeholder. please contact us for pricing

          No price
          Tustin, CA, USA
        • Royce System A45 61160

          • Manufacturer: Royce

            automatic die handling pick and place system. for picking die from diced wafers and transferring them to carriers. can pick and place die from wafer up to 8 in. dia. pc controller. 110-240v, 50/60 hz, 2a.

            $19,500
            Freehold Township, NJ, USA
          • Laurier SA-202 53582

            • Manufacturer: Laurier

              epoxy die bonder with rotary collet die pick up option. a production work station for mounting single or multiple dice on a diversity of substrates and packages. performs the functions of die pick-up, epoxy dispe...

              $3,950
              Freehold Township, NJ, USA
            • Semiconductor Equipment Corp. 410 52745

              • Manufacturer: Semiconductor Equipment Corp.

                flip chip die bonder. aligns and attaches flip chip die onto various substrates. versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated wor...

                $29,000
                Freehold Township, NJ, USA
              • Semiconductor Equipment Corp. 410 57636

                • Manufacturer: Semiconductor Equipment Corp.

                  flip chip die bonder. aligns and attaches flip chip die onto various substrates. versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated wor...

                  $29,000
                  Freehold Township, NJ, USA
                • Laurier SA-202 53779

                  • Manufacturer: Laurier

                    epoxy die bonder. provides fast, highly accurate chip placement and bonding. counter balanced and adjustable die pick-up arm. bausch & lomb stereozoom microscope.

                    $3,950
                    Freehold Township, NJ, USA
                  • Semiconductor Equipment Corp. 410X 52615

                    • Manufacturer: Semiconductor Equipment Corp.

                      flip chip die bonder. aligns and attaches flip chip die onto various substrates. granite table with granite risers. alignment accuracy is +/-5 microns. pc controller.

                      $25,000
                      Freehold Township, NJ, USA
                    • Laurier CP-222-S 54495

                      • Manufacturer: Laurier

                        chip placement system for use with pre-screened adhesives. simple vacuum pick up tool for die pick and place. stereozoom microscope.

                        $1,950
                        Freehold Township, NJ, USA
                      • Hypervision Chip Unzip 48882

                        • Manufacturer: Hypervision

                          backside preparation system. low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers...

                          $3,500
                          Freehold Township, NJ, USA