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Used electronics in para-burajiru

  • Trusted Seller
    MECHEL 772 EPOXY DIE BONDER

    MECHEL 772 EPOXY DIE BONDER

    • Manufacturer: MEI

    MECHEL 772 EPOXY DIE BONDER EPOXY DIE BONDER WITH NEW SYRINGE INCLUDES WORKHOLDER AND STEREO ZOOM OPTICS (NEW ELECTRONICS AND TOUCH SCREEN COVERED BY 1 YEAR WARRANTY)

    Billerica, MA
  • Trusted Seller
    ASM 802-00206/H asm die bonder

    ASM 802-00206/H asm die bonder part PCB 03-21817-04/A IOM2 controller

      5 in stock Experience precision and reliability with the ASM 802-00206/H die bonder, an essential tool for advanced semiconductor manufacturing. Designed for high-quality bondings, this equipment is a testament t...

      $625 USD
      New York, USA
    • Trusted Seller
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      Tokyo Electron Ltd 150 mm Mark-V

      • Manufacturer: Tokyo Electron - TEL

      Tokyo Electron Ltd 150 mm Mark-V 13 units available

      Bree, Ireland
    • Trusted Seller
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      Tokyo Electron Ltd Telius 305 SCCM Dielectric Etch

      • Manufacturer: Tokyo Electron - TEL

      Tokyo Electron Ltd. Telius 305 SCCM Dielectric Etch 300mm

      Bree, Ireland
    • Trusted Seller
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      KYOTO ELECTRONICS MKA-510

      • Manufacturer: Unknown

      KYOTO ELECTRONICS MKA-510

      Bree, Ireland
    • Trusted Seller
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      Canon Machinery BESTEM D531T

      • Manufacturer: Canon
      • Model: Bestem

      - Wafer Size: 300 - Group: Electronic - Category: Semiconductor Assembly & Packaging - Family: Bonding Equipment - Type: Hybrid Bonder

      Asia
    • Manual Epoxy and Eutectic Die

      Manual Epoxy and Eutectic Die Bonder

        MDSJHYZPGJ0225 Epoxy and Eutectic Die Bonder 1. Effective solution without touching the surface of the chip Clamp edge collapse problem 2. Automatic scribing, dispensing, sticking, automatic rebound height detec...

        Guangzhou, China
      • Manual Epoxy die bonder

        Manual Epoxy die bonder

          Features: 1. It can realize the function of automatic scribing of various patterns such as single-point dispensing, rectangle, rice character, etc. 2. Realize the soft contact of the suction nozzle, effectively s...

          Guangzhou, China
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          2008 PANASONIC PSX303M

          • Manufacturer: Panasonic

          Manufacturing process: assembly

          Tokyo, Japan
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          2019 DAITRON WJS-200C

          • Manufacturer: DAITRON

          Manufacturing process: assembly | Inch: 6

          Tokyo, Japan
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          2006 YAMATO DE610U

          • Manufacturer: Yamato
          • Model: DE610U

          Manufacturing process: assembly

          Tokyo, Japan
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          2014 LINTEC RAD-3510F12

          • Manufacturer: Lintec
          • Model: RAD-3510F12

          Manufacturing process: assembly | Inch: 8,12

          Tokyo, Japan
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          2007 DAGE DAGE-4000PXY

          • Manufacturer: Nordson DAGE

          Manufacturing process: assembly

          Tokyo, Japan
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          NOMURA MICRO SCIENCE N4C-3.0-120

          • Manufacturer: Nomura Micro Science

          Manufacturing process: assembly

          Tokyo, Japan
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          2005 MINAMI MK-880SV

          • Manufacturer: MINAMI

          Manufacturing process: assembly | Inch: Substrate M size

          Tokyo, Japan
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        Overview

        Bonders are specialized machines used to bond materials together, commonly employed in the semiconductor and electronics industries. They utilize various techniques like thermal, ultrasonic, or adhesive bonding to ensure precise and reliable connections between components, making them essential for manufacturing and assembly processes.

        FAQ

        What factors should I consider when purchasing a used bonder?

        Consider the machine's bonding technology, age, condition, and compatibility with your materials. Verify maintenance records and inspect for any signs of wear or damage.

        How can I ensure safe shipping for a bonder?

        Choose a reputable shipping company experienced in handling delicate machinery. Ensure the bonder is properly packed and secured to prevent damage during transit.

        What is the maintenance routine for a bonder?

        Regular maintenance includes cleaning bonding surfaces, checking for wear on critical components, and calibrating the machine. Follow the manufacturer’s maintenance schedule for optimal performance.