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Used processing

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    2006 YAMATO DE610U

    • Manufacturer: Yamato
    • Model: DE610U

    Manufacturing process: assembly

    Tokyo, Japan
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    2007 DAGE DAGE-4000PXY

    • Manufacturer: Nordson DAGE

    Manufacturing process: assembly

    Tokyo, Japan
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    NOMURA MICRO SCIENCE N4C-3.0-120

    • Manufacturer: Nomura Micro Science

    Manufacturing process: assembly

    Tokyo, Japan
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    2011 MUSASHI TAD1000

    • Manufacturer: Musashi

    Manufacturing process: assembly

    Tokyo, Japan
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    DAGE DAGE-4000PXY

    • Manufacturer: Nordson DAGE

    Manufacturing process: assembly

    Tokyo, Japan
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    DAGE DAGE-4000PXY

    • Manufacturer: Nordson DAGE

    Manufacturing process: assembly

    Tokyo, Japan
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    2019 DAITRON WJS-200C

    • Manufacturer: DAITRON

    Manufacturing process: assembly | Inch: 6

    Tokyo, Japan
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    2014 LINTEC RAD-3510F12

    • Manufacturer: Lintec
    • Model: RAD-3510F12

    Manufacturing process: assembly | Inch: 8,12

    Tokyo, Japan
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    2005 MINAMI MK-880SV

    • Manufacturer: MINAMI

    Manufacturing process: assembly | Inch: Substrate M size

    Tokyo, Japan
  • Submicron Semi-Auto Eutectic Die Bonder

    Submicron Semi-Auto Eutectic Die Bonder with table

      Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

      Guangzhou, China
    • Submicron Semi-Auto Eutectic Die Bonder

      Submicron Semi-Auto Eutectic Die Bonder RYW-ETB05B

        Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

        Guangzhou, China
      • Submicron Manual Rotary Die Bonder

        Submicron Manual Rotary Die Bonder RYW-ETB05

          Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

          Guangzhou, China
        • Submicron Manual Rotary Die Bonder

          Submicron Manual Rotary Die Bonder RYW-ETB05S

            Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

            Guangzhou, China
          • MD-DDM08 die demounter

            MD-DDM08 die demounter

            • Manufacturer: Minder Hightech

            Product features： 1. Suitable for wafer peeling process of 8 inches and below; 2. Adopting non-contact film stripping to prevent damage to grains and improve product qualification rate; 3. Simple and convenient o...

            Guangzhou, China
          • ACCµRA Plus: Dedicated to production

            ACCµRA Plus: Dedicated to production for Optoelectronic and Silicon photonics applications

              The ACCµRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes. ACCμRA Plus combines high precision, flexibility and short c...

              Singapore
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            Overview

            Bonders are specialized machines used to bond materials together, commonly employed in the semiconductor and electronics industries. They utilize various techniques like thermal, ultrasonic, or adhesive bonding to ensure precise and reliable connections between components, making them essential for manufacturing and assembly processes.

            FAQ

            What factors should I consider when purchasing a used bonder?

            Consider the machine's bonding technology, age, condition, and compatibility with your materials. Verify maintenance records and inspect for any signs of wear or damage.

            How can I ensure safe shipping for a bonder?

            Choose a reputable shipping company experienced in handling delicate machinery. Ensure the bonder is properly packed and secured to prevent damage during transit.

            What is the maintenance routine for a bonder?

            Regular maintenance includes cleaning bonding surfaces, checking for wear on critical components, and calibrating the machine. Follow the manufacturer’s maintenance schedule for optimal performance.