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Used force

  • Trusted Seller
    2017 Finetech FINEPLACER LAMBDA Sub-Micron

    2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy

    • Manufacturer: TDK - Lambda

    Includes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFlipChip software version 3.2 Revision 052 and PC manufacture date 2017

    United States
  • Trusted Seller
    ASM AD838L-G2

    ASM AD838L-G2

    • Manufacturer: ASM
    • Model: AD838

    ASM AD838L-G2 Die Bonder Details: - 2020 Vintage - 4 inch waffle pack holder - 2 inch waffle pack holder - 8 inch ring expander - Spare parts kit from OEM - Has a high force bond head

    United States
  • 2017 Finetech FINEPLACER LAMBDA Sub-Micron

    2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy

    • Manufacturer: TDK - Lambda

    Includes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFlipChip software version 3.2 Revision 052 and PC Option: Substrate heater 50mm x 50mm or 50mm x 10...

    $68,500 USD

    Get financing

    Est. $1,289/mo

    San Jose, CA
  • Trusted Seller
    2011 Datacon 2200 evo

    2011 Datacon 2200 evo

    • Manufacturer: Datacon
    • Model: 2200 EVO

    https://khs-semi.com/de/datacon-2200-evo Drive System: Dynamic servo drives in X, Y, Z, and P axes Vision System: Datacon image processing system for edge, structure, pattern, and ink-dot recognition Illumina...

    Germany
  • Trusted Seller
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    Synax S20

    • Manufacturer: Unknown

    Synax S20 Temp room to 130 Deg C, with 450 kgf contact force, 16 sites

    Bree, Ireland
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    FC300: The High Force and High Accuracy Die Bonder for Large Devices

      The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The tool features automated hand...

      Singapore
    • Manual Epoxy and Eutectic Die

      Manual Epoxy and Eutectic Die Bonder

        MDSJHYZPGJ0225 Epoxy and Eutectic Die Bonder 1. Effective solution without touching the surface of the chip Clamp edge collapse problem 2. Automatic scribing, dispensing, sticking, automatic rebound height detec...

        Guangzhou, China
      • 2018 Finetech FINEPLACER pico ma

        2018 Finetech FINEPLACER pico ma multi purpose die bonder with 5um accuracy

        • Manufacturer: Finetech

        Multi-purpose Die Bonder The FINEPLACER® pico ma is a cost effective bonder designed for prototyping or low-volume production, R&D labs and universities. This versatile platform is used in a wide range of micro a...

        $39,500 USD

        Get financing

        Est. $743/mo

        San Jose, CA

      Overview

      Bonders are specialized machines used to bond materials together, commonly employed in the semiconductor and electronics industries. They utilize various techniques like thermal, ultrasonic, or adhesive bonding to ensure precise and reliable connections between components, making them essential for manufacturing and assembly processes.

      FAQ

      What factors should I consider when purchasing a used bonder?

      Consider the machine's bonding technology, age, condition, and compatibility with your materials. Verify maintenance records and inspect for any signs of wear or damage.

      How can I ensure safe shipping for a bonder?

      Choose a reputable shipping company experienced in handling delicate machinery. Ensure the bonder is properly packed and secured to prevent damage during transit.

      What is the maintenance routine for a bonder?

      Regular maintenance includes cleaning bonding surfaces, checking for wear on critical components, and calibrating the machine. Follow the manufacturer’s maintenance schedule for optimal performance.