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Used generators

  • Trusted Seller
    GENERIC Closed Toe Mold Clamp

    GENERIC Closed Toe Mold Clamp CLAMP095 #88095

    • Manufacturer: Generic

    Closed End Slot: 3.80" x 3/4" Expedited shipping services are available This piece is located at Ideal Machinery, Inc. on our showroom floor. Located at: 10230 N. Holly Rd, Holly MI 48442

    $14 USD
    Warehouse
  • Trusted Seller
    UNKNOWN MAKE Mold Die Clamp

    UNKNOWN MAKE Mold Die Clamp NR-050 USED #26107

    • Manufacturer: UNKNOWN MAKE

    ** Lot of 3 ** 4.75" x 1 5/8" x 1.25" Closed Toe Expedited shipping services are available This piece is located at Ideal Machinery, Inc. on our showroom floor. Located at: 10230 N. Holly Rd, Holly MI 48442

    $40 USD
    Warehouse
  • Trusted Seller
    Royce Instruments DE35i-6 pick and

    Royce Instruments DE35i-6 pick and place for wafers up to 150mm

    • Manufacturer: Royce Instruments
    • Model: DE 35

    Royce DE35i-6 semiautomatic pick and place configured with clamping device for wafers up to 150mm vacuum pickup of die from film mounted wafers and places into waffle packs minimum die size 0.008" square Opte...

    United States
  • Trusted Seller
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    Lot of 11 NEC/TOKIN UPD5201C 80220

    • Manufacturer: NEC

    Mpn: UPD5201C | Simple part number: UPD5201C | Lot of: 11 | Shipping weight: 10.00 LBS | Shipping dimensions: 12.00 (in) x 12.00 (in) x 12.00 (in)

    $200 USD
    El Paso, TX
  • Royce Instruments DE35i-6 pick and

    Royce Instruments DE35i-6 pick and place for wafers up to 150mm

    • Manufacturer: Royce Instruments
    • Model: DE 35

    Royce DE35i-6 semiautomatic pick and placeconfigured with clamping device for wafers up to 150mm vacuum pickup of die from film mounted wafers and places into waffle packsminimum die size 0.008" squareOptem zoom ...

    $9,650 USD

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    Est. $190/mo

    San Jose, CA
  • Trusted Seller
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    GENERAL DYNAMICS A71884-002

    • Manufacturer: Unknown

    Bree, Ireland
  • Trusted Seller
    Die Bonder Hybrid DATACON -

    Die Bonder Hybrid DATACON - 2200 evo

    • Manufacturer: Datacon
    • Model: 2200 EVO

    Die Bonder Hybrid, DATACON - 2200 evo Vintage 2016, Gen3 1.Location, CMTec AG, Switzerland 2.EVO Generation, Generation 3 3. Software version, on request 4.Operation system, on request 5.Condition, refurbished 6....

    Steinhausen, Switzerland
  • MD-DDM08 die demounter

    MD-DDM08 die demounter

    • Manufacturer: Minder Hightech

    Product features： 1. Suitable for wafer peeling process of 8 inches and below; 2. Adopting non-contact film stripping to prevent damage to grains and improve product qualification rate; 3. Simple and convenient o...

    Guangzhou, China
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    FC300: The High Force and High Accuracy Die Bonder for Large Devices

      The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The tool features automated hand...

      Singapore

    Overview

    Bonders are specialized machines used to bond materials together, commonly employed in the semiconductor and electronics industries. They utilize various techniques like thermal, ultrasonic, or adhesive bonding to ensure precise and reliable connections between components, making them essential for manufacturing and assembly processes.

    FAQ

    What factors should I consider when purchasing a used bonder?

    Consider the machine's bonding technology, age, condition, and compatibility with your materials. Verify maintenance records and inspect for any signs of wear or damage.

    How can I ensure safe shipping for a bonder?

    Choose a reputable shipping company experienced in handling delicate machinery. Ensure the bonder is properly packed and secured to prevent damage during transit.

    What is the maintenance routine for a bonder?

    Regular maintenance includes cleaning bonding surfaces, checking for wear on critical components, and calibrating the machine. Follow the manufacturer’s maintenance schedule for optimal performance.