Building Filters
- Trusted Seller

Datacon 2200 Evo
- Manufacturer: Datacon
- Model: 2200 EVO
Datacon 2200 Evo Vintage 2011 Tool features: • High speed multi chip module assembly • SiP – stacked die / epoxy, spacer film and WBL (Wafer Backside Lamination) • Thin die handling (down to below 30 µm) • Reticl...
Bree, Ireland 
2007 SHINKAWA SPA300 Super
- Manufacturer: Shinkawa
- Model: SPA-300
Equipment name: Solidifying machine and laminating machine
Suzhou, China
ASM IS868LA
- Manufacturer: ASM
- Model: IS868LA
Equipment name: Solidifying machine and laminating machine
Suzhou, China
SHINKAWA SPA300
- Manufacturer: Shinkawa
- Model: SPA-300
Equipment name: Solidifying machine and laminating machine
Suzhou, China
2005 ASM AD898
- Manufacturer: ASM
- Model: AD898
Equipment name: Solidifying machine and laminating machine
Suzhou, China
2000 ASM AD889
- Manufacturer: ASM
- Model: AD889
Equipment name: Solidifying machine and laminating machine
Suzhou, China
Suzhou, China
Panasonic DM60
- Manufacturer: Panasonic
- Model: DM60
Equipment name: Solidifying machine and laminating machine
Suzhou, China
1999 SHINKAWA SPA310
- Manufacturer: Shinkawa
Equipment name: Solidifying machine and laminating machine
Suzhou, China
Suzhou, China
ASM IS8912DA
- Manufacturer: ASM
- Model: IS8912DA
Equipment name: Solidifying machine and laminating machine
Suzhou, China
ASM AD8312
- Manufacturer: ASM
The AD838 is an automatic high speed epoxy die bonder with up to 4" (101.6 mm) substrate width handling capability, It is highly flexible in handling wide range of die sizes for your IC and discrete packages.
Suzhou, China
Suzhou, China
Suzhou, China
ASM IS9012TC
- Manufacturer: ASM
- Model: IS9012TC
Equipment name: Solidifying machine and laminating machine
Suzhou, China
