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ASM AD898 Die Bonder
- Manufacturer: ASM
- Model: AD898
“UNIT AS SHOWN IN PICTURES, No additional items included in sale. FOR PARTS OR REPAIR ONLY, NO WARRANTY” ASM AD898 Die Bonder 0-SJ-95268-MY-GX FOR PARTS OR REPAIR. This item is not eligible for a return warranty....
- Trusted Seller
ASM Die Bonding 2574713-21 Rev. B Relay Switching Modul
3 in stock The ASM Die Bonding 2574713-21 Rev. B Relay Switching Module is a component designed for semiconductor manufacturing equipment. Specifically, it is a relay switching module used in the die bonding proc...
$200 USDNew York, USA 
AD898 | ASM Die Bonder - For parts or not working
- Manufacturer: ASM
- Model: AD898
- Trusted Seller
DATACON BESI 2200 EVO Like New Year 2012 Europe
- Manufacturer: Datacon
- Model: 2200 EVO
DATACON 2200 EVO Vintage 2012 ( Available November 2019 in Europe ) In R&D Facility Like new – Hardly Used Comes with many extra spares The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultima...
Bree, Ireland 
Submicron Semi-Auto Eutectic Die Bonder with table
Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...
Guangzhou, China
Submicron Semi-Auto Eutectic Die Bonder RYW-ETB05B
Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...
Guangzhou, China
Submicron Manual Rotary Die Bonder RYW-ETB05
Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...
Guangzhou, China
Submicron Manual Rotary Die Bonder RYW-ETB05S
Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...
Guangzhou, China
MD-DDM08 die demounter
- Manufacturer: Minder Hightech
Product features： 1. Suitable for wafer peeling process of 8 inches and below; 2. Adopting non-contact film stripping to prevent damage to grains and improve product qualification rate; 3. Simple and convenient o...
Guangzhou, China
MDAX-FC810 flip chip die bonder
MDAX-FC810 flip chip die bonder This model is a fixed crystal mount machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging flip chips A...
Guangzhou, China
