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Used table

  • Trusted Seller
    Asymtek Automove 402

    Asymtek Automove 402

    • Manufacturer: Nordson Asymtek

    ASYMTEK AUTOMOVE 402 TABLE TOP DISPENSING UNIT

    Billerica, MA
  • Trusted Seller
    ESEC 2008 HS3 PLUS

    ESEC 2008 HS3 PLUS

    • Manufacturer: ESEC
    • Model: 2008 HS3 Plus

    ESEC 2008 HS3 PLUS 6 available units 12inch & 8 inch wafer table working condition Vintages 2005-2007 in Warehouse

    Bree, Ireland
  • Trusted Seller
    ESEC 2008XP3 Bonder

    ESEC 2008XP3 Bonder

    • Manufacturer: ESEC
    • Model: 2008 xP3

    ESEC 2008XP3 Bonder We have 6 sets of ESEC 2008XP3 Bonder 's for sale in Asia. They are now in storage. 8" and 12" tables available. No Missing. Working condition before deinstall. No facility to power on so sell...

    Trim, Ireland
  • Trusted Seller
    BESI DATACON 2200 EVO Dual

    BESI DATACON 2200 EVO Dual Head

    • Manufacturer: Datacon
    • Model: 2200 EVO

    BESI DATACON 2200 EVO excellent condition Dual Head Auto Ejector Vintage 2011 Datacon Evo 2200 Configuration 6 X DC0158 P-part for main axis included 6 X DC6028 P-Part for ID axis Auto Transport systems Bergquist...

    Bree, Ireland
  • Trusted Seller
    2011 Datacon 2200 evo

    2011 Datacon 2200 evo

    • Manufacturer: Datacon
    • Model: 2200 EVO

    https://khs-semi.com/de/datacon-2200-evo Drive System: Dynamic servo drives in X, Y, Z, and P axes Vision System: Datacon image processing system for edge, structure, pattern, and ink-dot recognition Illumina...

    Germany
  • Trusted Seller
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    SHIBATEC 2FA31331

    • Manufacturer: Unknown

    SHIBATEC 2FA3133#1 UNDER TABLE 30 day parts warranty on all new parts. Available 2017

    Bree, Ireland
  • Trusted Seller
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    ALPHASEM 950828

    • Manufacturer: Unknown

    ALPHASEM 950828 MOTOR, FINAL TABLE ASSEMBLY 30 day parts warranty on all new parts. Available 2017

    Bree, Ireland
  • Trusted Seller
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    Mech-El 709

    • Manufacturer: MEI

    Mech-El 709 MECH-EL EUTECTIC DIE BONDER The Mech-El/MEI 709 is a manual eutectic die attacher. The machine comes with a 2 position slide table for die presentation and heated work holder. The MEI 709 uses a uniqu...

    Bree, Ireland
  • Trusted Seller
    2013 ASM AD838

    2013 ASM AD838

    • Manufacturer: ASM
    • Model: AD838

    Magazine and stack loader input Magazine output 8 Inch wafer table and expansion unit Dispensing system Rotary Bond Head

    Asia
  • Trusted Seller
    ESEC 2008HS3 Plus

    ESEC 2008HS3 Plus

    • Manufacturer: ESEC
    • Model: 2008 HS3 Plus

    ESEC 2008HS3 Plus Die Bonder refurbished condition Configuration – 12” wafer table, Writing dispenser, TOS input, Magazine output, wafer map, OBC, PostIQC.

    Asia
  • Trusted Seller
    2014 ASM AD838 Die Bonder

    2014 ASM AD838 Die Bonder

    • Manufacturer: ASM
    • Model: AD838

    ASM AD838 Die Bonder Vintage;2014 Magazine and stack loader input Magazine output 8 inch wafer table and expansion unit Dispense: Writing dispense Rotary Bond Head

    Asia
  • Trusted Seller
    2003 ASM AD-8912 Die Bonder

    2003 ASM AD-8912 Die Bonder

    • Manufacturer: ASM

     Wafer Diameter Maximum 12" (300 mm)  Wafer XY Table Travel (13” x 13”) 334 x 334mm  Die Size (10 x 10 mil to 1000 x 1000 mil)  Die Placement Accuracy XY (0.38 mil)8.38um  Epoxy Fillet Height (<2/3 of di...

    Asia
  • Trusted Seller
    2004 ASM AD-8912 Die Bonder

    2004 ASM AD-8912 Die Bonder

    • Manufacturer: ASM

     Wafer Diameter Maximum 12" (300 mm)  Wafer XY Table Travel (13” x 13”) 334 x 334mm  Die Size (10 x 10 mil to 1000 x 1000 mil)  Die Placement Accuracy XY (0.38 mil)8.38um  Epoxy Fillet Height (<2/3 of di...

    Asia
  • Submicron Semi-Auto Eutectic Die Bonder

    Submicron Semi-Auto Eutectic Die Bonder with table

      Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

      Guangzhou, China
    • Dual head high speed Die

      Dual head high speed Die Bonder

        MDAX64DI-25-3 Planar Dual head high-speed Die Bonder Applicable to SMD2020 1010 2121 2835 5730, filament, etc 一、Model characteristics 1. Independent double head die bonding, double stamp arm, double wafer search ...

        Guangzhou, China
      12

      Overview

      Bonders are specialized machines used to bond materials together, commonly employed in the semiconductor and electronics industries. They utilize various techniques like thermal, ultrasonic, or adhesive bonding to ensure precise and reliable connections between components, making them essential for manufacturing and assembly processes.

      FAQ

      What factors should I consider when purchasing a used bonder?

      Consider the machine's bonding technology, age, condition, and compatibility with your materials. Verify maintenance records and inspect for any signs of wear or damage.

      How can I ensure safe shipping for a bonder?

      Choose a reputable shipping company experienced in handling delicate machinery. Ensure the bonder is properly packed and secured to prevent damage during transit.

      What is the maintenance routine for a bonder?

      Regular maintenance includes cleaning bonding surfaces, checking for wear on critical components, and calibrating the machine. Follow the manufacturer’s maintenance schedule for optimal performance.