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Westbond 7374B
- Manufacturer: West Bond
- Model: 7374B
Westbond 7374B ultrasonic die bonder with heated tool
United States - Trusted Seller

Royce Instruments DE35i-6 pick and place for wafers up to 150mm
- Manufacturer: Royce Instruments
- Model: DE 35
Royce DE35i-6 semiautomatic pick and place configured with clamping device for wafers up to 150mm vacuum pickup of die from film mounted wafers and places into waffle packs minimum die size 0.008" square Opte...
United States - Trusted Seller

ASM AD896-06
- Manufacturer: ASM
- Model: AD896
United States - Trusted Seller

2022 BESI Datacon 2200 evo plus
- Manufacturer: Datacon
- Model: 2200 EVO
- Die Attach, Flip Chip & Multi-Chip Capability - Upgraded Camera & Image Processing - Large Format Heated Stage - Thermal Compensation - Never Used for Production - Open Platform Architecture Condition Like New...
United States 
Westbond 7374B ultrasonic die bonder with heated tool
- Manufacturer: West Bond
- Model: 7374B
sn 14691 see specifications below Sort: 0

2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy
- Manufacturer: TDK - Lambda
Includes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFlipChip software version 3.2 Revision 052 and PC Option: Substrate heater 50mm x 50mm or 50mm x 10...

CANARE TCD-451CA 3A1023
- Manufacturer: CANARE
CANARE TCD-451CA 3A1023 System was de-installed in working operational condition. All returns must comply with stated Return Policy. Please continue: PAYMENT OPTIONS: We accept Paypal, Company Check, Wire Transfe...
$139 USDSanta Barbara, CA
PRECISION DIAMOND GANG ARBOR ASSEMBLY
- Manufacturer: MTI
INCLUDES: MTI DGA2542-C SLICE-SCRIBE. System was de-installed in working operational condition. All returns must comply with stated Return Policy. Please continue: PAYMENT OPTIONS: We accept Paypal, Company Check...
$550 USDSanta Barbara, CA
Royce Instruments DE35i-6 pick and place for wafers up to 150mm
- Manufacturer: Royce Instruments
- Model: DE 35
Royce DE35i-6 semiautomatic pick and placeconfigured with clamping device for wafers up to 150mm vacuum pickup of die from film mounted wafers and places into waffle packsminimum die size 0.008" squareOptem zoom ...

AD898 | ASM Die Bonder - For parts or not working
- Manufacturer: ASM
- Model: AD898
- Trusted Seller

NEW 10 ft Hemming Die Bottom – Supplies and Accessories Tooling
- Manufacturer: LENMARK INDUSTRIES
$685 USDBritish Columbia, Canada - Trusted Seller

ASM 802-00206/H asm die bonder part PCB 03-21817-04/A IOM2 controller
5 in stock Experience precision and reliability with the ASM 802-00206/H die bonder, an essential tool for advanced semiconductor manufacturing. Designed for high-quality bondings, this equipment is a testament t...
$625 USDNew York, USA - Trusted Seller

EDWARDS PDOB9/16X1
- Manufacturer: Edwards
Fits in standard punch holder . Punch: 9/16"x1" | Die: 19/32"x1-1/32" | Stock_no: 100763
$259 USDBritish Columbia, Canada - Trusted Seller

NOBEL ELEKTRONIK KISD-6R
- Manufacturer: NOBEL ELEKTRONIK
Rated load rl: 50, 100, 200, 400, 1000 kN | Material: Stainless steel | Maximum supply voltage: 18 VDC/AC
$1,903 USDBritish Columbia, Canada 
02-15783-08 | ASM Servo Driver Rev D AD 898 APD20 AC Dual - For parts or not working
- Manufacturer: ASM
- Model: AD898
$2,625 USDBaroda, MI
West Bond 7374B Die Bonder
- Manufacturer: West Bond
- Model: 7374B
Good condition West Bond 7374B Die Bonders. Located in USA and other countries. Click request price for more information.
USA
