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DISCO DFD640
- Manufacturer: ディスコ
- Model: DFD640
Capable of dicing wafers up to 8 inches. This fully automatic dicing machine can automatically remove a frame with a maximum 8-inch wafer mounted from the cassette, transfer it to the chuck table This fully autom...
Toda, Japan - Trusted Seller
DISCO DFD651
- Manufacturer: ディスコ
- Model: DFD651
Equipped with dual spindles for dicing of up to 8-inch wafers.
Toda, Japan - Trusted Seller
DISCO DFD641
- Manufacturer: ディスコ
- Model: DFD641
Capable of dicing wafers up to 8 inches. This fully automatic dicing machine can automatically remove a frame with a maximum 8-inch wafer mounted from the cassette, transfer it to the chuck table This fully autom...
Toda, Japan - Trusted Seller
DISCO DAD340
- Manufacturer: ディスコ
- Model: DAD340
Toda, Japan - Trusted Seller
DISCO DAD552
- Manufacturer: ディスコ
Toda, Japan - Trusted Seller
DISCO DFD6750
- Manufacturer: ディスコ
- Model: DFD6750
Toda, Japan - Trusted Seller
Toda, Japan - Trusted Seller
Toda, Japan - Trusted Seller
Disco DFD6340
- Manufacturer: ディスコ
- Model: DFD6340
Toda, Japan - Trusted Seller
Toda, Japan - Trusted Seller
DISCO DCS1440
- Manufacturer: ディスコ
double cleaning arm specifications A arm two-fluid arm side rinse piping has special piping for discharging developer (If the special piping for discharging developer is not used, there is no problem with normal ...
Toda, Japan - Trusted Seller
DISCO DTU152
- Manufacturer: ディスコ
This device keeps both the spindle cooling water and cutting water at a constant temperature and at the appropriate pressure.
Toda, Japan - Trusted Seller
DISCO DAD3350
- Manufacturer: ディスコ
- Model: DAD3350
Automatic dicing machine for 8-inch 2.2kw spindle single spindle Equipped with LCD touch panel and GUI
Toda, Japan - Trusted Seller
Toda, Japan - Trusted Seller
DISCO DFD650
- Manufacturer: ディスコ
- Model: DFD650
Equipped with dual spindles for dicing of up to 8-inch wafers.
Toda, Japan 
Disco DAD3350 Assembly / Packaging (semiconductors)
- Manufacturer: Disco
- Model: DAD3350
Good condition Disco DAD3350 Assembly / Packaging (semiconductors)s available between 2008 and 2011 years. Located in USA and other countries. Click request price for more information.
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