DISCO GNX300
- Manufacturer: Disco
Okamoto gnx300 12 inch wafer back ultra-thin grinding and thinning equipment, with new color and high precision in 2005. The company has a professional service team to provide after-sales machine spare parts main...
Suzhou, China
2004 DISCO DFG 850
- Manufacturer: Disco
- Model: DFG850
The Disco dfg850 8" back wafer grinding and thinning machine, compatible with 4-5-6" products. high efficiency.
Suzhou, China
Suzhou, China
2004 DISCO DFG860
- Manufacturer: Disco
- Model: DFG860
Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning.
Suzhou, China
1998 DISCO DFG841
- Manufacturer: Disco
- Model: DFG841
Suzhou, China
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