Used ESEC Die Bonders

ESEC 2006HR

• Manufacturer: ESEC
• Model: 2006HR

Manufacturer: ESEC Type: Die Bonder Model: 2006HR Description: ESEC 2006HR Die Bonder

ESEC 2008 HL

• Manufacturer: ESEC
• Model: 2008

Manufacturer: ESEC Type: Die Bonder Model: 2008 HL Description: ESEC 2008HL Die Bonder

ESEC 2007IC8

• Manufacturer: ESEC
• Model: 2007

Manufacturer: ESEC Type: Die Bonder Model: 2007IC8 Description: ESEC 2007IC8 Die Bonder

ESEC 2008XP3

• Manufacturer: ESEC
• Model: 2008 xP3

Manufacturer: ESEC Type: Die Bonder Model: ESEC 2008XP3 Description: ESEC 2008XP3 Die Bonder

ESEC 2008SC3 Plus

• Manufacturer: ESEC
• Model: 2008 SC

Manufacturer: ESEC Type: Die Bonder Model: ESEC 2008SC3 Plus Description: ESEC 2008SC3 Plus Smart Card Die Bonder

ESEC 2008HS3 Plus

• Manufacturer: ESEC
• Model: 2008 HS3 Plus

ESEC 2008HS3 Plus Die Bonder refurbished condition Configuration – 12” wafer table, Writing dispenser, TOS input, Magazine output, wafer map, OBC, PostIQC.

ESEC 3100

• Manufacturer: ESEC
• Model: 2100

ESEC 3100/3100PLUS bonders several sets available were deinstalled, working condition 2005~2007 vintages Sold as-is

ESEC 2006HR

• Manufacturer: ESEC
• Model: 2006HR

ESEC 2006HR Die Bonder Ex-Works. Spare part available.

ESEC 2008 HL

• Manufacturer: ESEC
• Model: 2008

ESEC 2008HL Die Bonder Ex-Works. Ready stock for cusotmer buyoff/inspection. Machine configuration to follow customer requirement.

ESEC 2007IC8

• Manufacturer: ESEC
• Model: 2007

ESEC 2007IC8 Die Bonder Ex-Works. Most spare part available on stock.

ESEC 2008XP3

• Manufacturer: ESEC
• Model: 2008 xP3

ESEC 2008XP3 Die Bonder Ex-Works. Multiple units available. Handle up to 300mm wafer. Configuration according to customer request.

ESEC 2007SSI Plus

• Manufacturer: ESEC
• Model: 2007

ESEC 2007SSI Plus Soft Solder Die Bonder Ex-Works. With existing customer LF type. Require conversion kit for dedicated customer LF type. Reconfiguration of machine.

ESEC Smart Card Line

• Manufacturer: ESEC
• Model: 2008 HS3 Plus

Smart Card line with ESEC DA; Bondztek Inline Oven including Reel handler Die Attach: ESEC 2008HS3 Plus Wire Bonder: ESEC 3100 SC Plus Inline Oven: Bondztek Inline Oven

Esec 2008xP3 Die Bonder

• Manufacturer: ESEC
• Model: 2008 xP3

ESEC 2008SC3 Plus

• Manufacturer: ESEC
• Model: 2008 SC

ESEC 2008SC3 Plus Smart Card Die Bonder Ex-Works. Smart card die attach, handle up to 300mm wafer. Configuration of machine base on customer request.