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Used controller

  • 2011 SPTS/STS MUC-21 ETCHER

    2011 SPTS/STS MUC-21 ETCHER

    • Manufacturer: SPTS

    GAS BOX CONFIG GAS 1: UNIT UFC-8101 100 SCCM Ar GAS 2: UNIT UFC-8101 100 SCCM O2 GAS 3: UNIT UFC-8101 600 SCCM SF6 GAS 4: UNIT UFC-8101 400 SCCM C4F8 GAS 5: MKS 649A-26199 N2 TURBO PUMP TURBO PUMP: LEYBOLD...

    Wu Xi Shi, China
  • Trusted Seller
    2006 Oxford PlasmaLab System 100

    2006 Oxford PlasmaLab System 100 RIE (FL) Reactive Ion Etcher

    • Manufacturer: Oxford

    Condition : Refurbished with OEM specifications Configuration: - Supports wafer sizes up to 300mm (330mm Platen) - RIE set up for SiO2 Etch - RF Generator : Advanced Energy RFX 600A ; 600W, 13.56MHz, - Chamber ...

    Asia
  • Trusted Seller
    TRION PHANTOM II RIE ICP

    TRION PHANTOM II RIE ICP REACTIVE ION ETCHER w INDUCTIVELY COUPLED PLASMA SOURCE

    • Manufacturer: Trion

    TRION TECHNOLOGY PHANTOM II RIE ICP REACTIVE ION ETCHER w INDUCTIVELY COUPLED PLASMA SOURCE Unit Specifications Make: Trion Technology Model: Phantom II Type: Reactive Ion Etcher (RIE) Configured and comes w...

    Asia
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    TEL Unity II 85 TPA

    • Manufacturer: Tokyo Electron - TEL

    Polymide Electrostatic Chuck hardware for wafer with Dual He cooling system / Cassette load lock protection for Process chamber / Two(2) Daihen RF Generator / Two(2) Daihen Automation Matching Network / Two(2) SM...

    Yongin-si, South Korea
  • GASONICS GASONIC L3510

    GASONICS GASONIC L3510

    • Manufacturer: GaSonics

    GASONIC L3510 Single Wafer Downstream Photoresist Asher 8” configured (can change to 6” ) Quartz Plasma Tube and Baffles ASTEX Microwave 1.2kw Temperature Controlled Wafer Cooled Aluminum Process Chamber ...

    Gyeonggi-do, South Korea
  • Wintel Poly Etcher

    Wintel Poly Etcher

    • Manufacturer: Wintel

    LPR (Low-Pressure Removal) PE ALD Poly Etcher HARC Doped ACL EER EUV Application : DPT, QPT, Hard mask etch etc. Excellent Uniformity ＜1% (Concentric profile) Improved wafer edge uniformity : Wide plasma generati...

    Gyeonggi-do, South Korea
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    Vacuum Etching Machine Acid Etcher Alkaline Etching PCB Production Line

      Vacuum etching machine uniformity ≥90%, etching factor ≥3.5 times. The vacuum suction device makes the spray operating system generate negative pressure, forming a low suction force, absorbing the etching liquid ...

      Beijing, China
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    Overview

    Etching systems are industrial machines used to remove material from substrates using chemical, plasma, or wet etch processes for PCBs, semiconductors, metals, and decorative finishes. Equipment ranges from benchtop wet etchers to inline plasma/RIE units with process control, exhaust filtration and automation. Buyers prioritize process compatibility, throughput, waste handling, safety features, and the availability of spare parts and consumables when evaluating used or refurbished units.

    FAQ

    What should I check when buying a used etching system?

    Verify process compatibility (chemical vs. plasma), chamber and fixture condition, integrity of seals and pumps, controller/software status, maintenance logs, exhaust and filtration systems, and availability of spare parts and consumables. Ask about prior processes that may have contaminated the unit.

    How do I arrange safe shipping for an etching system?

    Decontaminate and neutralize all chemicals, drain fluids, disconnect gas and power, and document hazardous-materials history. Use a transporter experienced with lab/semiconductor equipment, crate and secure components, insure the shipment, and prepare required hazmat paperwork and permits.

    What regular maintenance does an etching system need?

    Routine tasks include chamber cleaning, filter and pump replacement, vacuum seal inspection, gas-line leak tests, controller calibration, and proper waste neutralization/disposal. Keep logs, follow manufacturer service intervals, and replace consumables proactively to maintain process consistency.