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  • Trusted Seller
    Bond Aligner EVG 520

    Bond Aligner EVG 520

    • Manufacturer: EVG
    • Model: 520

    -Tooling for 6" Wafer inclusive Bond Chuck and Pressure Insert -Capable of fusion compression bonding -Capable of thermal compression bonding -Capable of anodic bonding -Ideal for R&D and pilot production app...

    Europe
  • Trusted Seller
    2017 EVG 6200 NT

    2017 EVG 6200 NT

    • Manufacturer: EVG
    • Model: 6200

    - Double side - Manual handling - Exposure Modes: Hard, Soft, & Vacuum Contact - Separation Distance: 0 - 300 µm adjustable via software - Wafer Thickness: 0.1 - 10 mm (For Top Side) - Semi Automatic Loading...

    Singapore
  • 2012 EVG 6200 BA Infinity

    2012 EVG 6200 BA Infinity

    • Manufacturer: EVG
    • Model: 6200

    Vintage 2012 Refurbishment, warranty, installation, training, service and support available Available for full inspection and demonstration Manual Bond Aligner Backside Alignment (BSA) Manual Handling Automatic J...

    Ashford, United Kingdom
  • EVG 620

    EVG 620

    • Manufacturer: EVG
    • Model: 620

    Refurbishment, warranty, installation, training, service and support available Available for full inspection and demonstration Topside Alignment (TSA) Manual Handling Manual Controlled Stage Tooling Tray Uniformi...

    Ashford, United Kingdom