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HGTECH Wafer Slotting Series Wafer Laser Slotting Equipment
- Manufacturer: Hgtech
Product advantages: Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position Based on spatial light mo...
Wuhan, China
HGTECH SOLAR PV-SCREEN PRINTING GRID VERSION FILM CUTTING EQUIPMENT Photovoltaic Laser Processing
- Manufacturer: Hgtech
Uniqueness: a unique light path system can be designed according to the characteristics of the grid lines High speed oscilloscope processing, extremely fast scanning Highly compatible: according to the customer's...
Wuhan, China
HGTECH Wafer Cutting Series Wafer Laser Modified Cutting Equipment
- Manufacturer: Hgtech
Product advantages: There is no damage on the surface, no cutting seam, and the edge collapse is very small (≤ 2 μ m) , the edge is small (< 3 μ m） Multi focus modification mode can be adopted to multiply the cut...
Wuhan, China
HGTECH PHOTOVOLTAIC GLASS PUNCHING EQUIPMENT Photovoltaic Laser Processing
- Manufacturer: Hgtech
Adopting an imported picosecond/short pulse width laser, good beam quality, small focus spot, high stability The machine can be equipped with a multi-vibration lens system to reduce the laser processing time The ...
Wuhan, China
HGTECH Wafer Marking Series Wafer Laser Marking Equipment
- Manufacturer: Hgtech
Product advantages: Special robot for wafer automatic picking and placing, automatic focusing With different light sources, it can adapt to different accuracy levels Intelligent, visual positioning + automatic ed...
Wuhan, China
HGTECH Laser Scribing Series Picosecond Laser Scribing Equipment
- Manufacturer: Hgtech
Product advantages： Cutting line width is narrow (taking ultraviolet collimation as an example, cutting line width + HAZ ≤ 20 ± 5 μ m) Small edge collapse (≤ 10 μ m） UPH ≥ 10 (UV galvanometer: take 3-inch double ...
Wuhan, China
HGTECH Laser Scribing Series Nanosecond Laser Scribing Equipment
- Manufacturer: Hgtech
Product advantages: The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, includ...
Wuhan, China
HGTECH LCK10G PCB-IC CARRIER BOARD DEFECT IDENTIFICATION
- Manufacturer: Hgtech
Equipment characteristics Equipment characteristicsEquipment characteristics
Wuhan, China
HGTECH Defect Detection Series Semiconductor Substrate Defect Detection Equipment
- Manufacturer: Hgtech
Product advantages: Suitable for 4-8 inch wafers, substrates, epitaxial wafers and patterned wafers Detect particles, pits, bumps, scratches, stains, cracks and other defects System resolution: 1-10 μ m No patter...
Wuhan, China
HGTECH Wafer Defect Detection Series Semiconductor Wafer Defect Detection Equipment
- Manufacturer: Hgtech
Product advantages: This equipment can be used for 4-8 inch patterned wafers Detect defects such as scratch, back collapse, color difference, crack, scratch, metal residue and metal loss System resolution: 0.2-0....
Wuhan, China
HGTECH SMT Double Head PCB Laser Marking Series SMT Double Head PCB Laser Marking Machine
- Manufacturer: Hgtech
Applicable to PCBA production line, offline/online mode can be selected according to needs,automatic laser coding and reading detection can be realized through the precise positioning of equipment automatic trans...
Wuhan, China
HGTECH Wafer Thickness Measuring Series Semiconductor Wafer Thickness Measuring Equipment
- Manufacturer: Hgtech
Product advantages: Used for 4-8 inch original wafer, substrate and epitaxial wafer of various materials and polishing conditions Thickness range: 0-1mm measurement accuracy: ± 1 μ M repetition accuracy: 0.2 μ m ...
Wuhan, China
High precision 3D robot laser cutting machine workstation sheet metal and shaped workpiece processing equipment
- Manufacturer: Hgtech
- Cutting thickness: 30 mm
3D 5-axis Laser Cutting Machine 3D 5-axis Laser Cutting Machine ,it is a kind of laser processing equipment specially developed for automobile hot forming parts. lt mainly solves theproblem of cutting holes and t...
HGTECH High speed AUTOBOT Series top robot fiber laser cutting machine sheet and pipe Metal 5 axis 3d laser cutting machine
- Manufacturer: Hgtech
- Cutting thickness: 30 mm
3D 5-axis Laser Cutting Machine 3D 5-axis Laser Cutting Machine ,it is a kind of laser processing equipment specially developed for automobile hot forming parts. lt mainly solves theproblem of cutting holes and t...
HGTECH LSF20LI Auto Data Label Laser Marking Machine
- Manufacturer: Hgtech
HGTECH LSF20LI Auto Data Label Laser Marking Machine is designed for the automotive industry, this machine utilizes a fiber laser, rewinding structure, and mechanical cutting to perform both marking and cutting i...
Wuhan, China