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HGTECH LUA3200 Fully Automated Wafer Laser Annealing Machine
- Manufacturer: Hgtech
HGTECH LUA3200 Ultra-efficient Fully Automated Wafer Laser Annealing Machine：The EFEM system pre-positions the wafer, a customized laser annealing head and precision motion platform work together to anneal the en...
Wuhan, China
HGTECH LUSD3310 Fully Automatic SiC Wafer Modification and Cutting Equipment
- Manufacturer: Hgtech
The Fully Automatic SiC Wafer Modification and Cutting Equipment LUSD3310 uses multiple high-precision CCD vision cameras to automatically identify and locate 6-8 inch wafers with various die specifications. Comb...
Wuhan, China
HGTECH LSF20LI Auto Data Label Laser Marking Machine
- Manufacturer: Hgtech
HGTECH LSF20LI Auto Data Label Laser Marking Machine is designed for the automotive industry, this machine utilizes a fiber laser, rewinding structure, and mechanical cutting to perform both marking and cutting i...
Wuhan, China
HGTECH MED-CS05 Automatic Laser Coding Intelligent Equipment for Cryogenic Vials
- Manufacturer: Hgtech
HGTECH Automatic Laser Coding Intelligent Equipment for Cryogenic Vials targets biological testing laboratories, hospital pathology departments, or biological sample libraries, sample storage management and trace...
Wuhan, China
HGTECH Defect Detection Series Semiconductor Substrate Defect Detection Equipment
- Manufacturer: Hgtech
Product advantages: Suitable for 4-8 inch wafers, substrates, epitaxial wafers and patterned wafers Detect particles, pits, bumps, scratches, stains, cracks and other defects System resolution: 1-10 μ m No patter...
Wuhan, China
HGTECH Flying8000 Series Plastic Cap Sorting and Laser Marking Coding System
- Manufacturer: Hgtech
HGTECH Flying8000 Series Cap Sorting and Laser Marking Coding System Custom-built for the beverage industry, this laser-based cap sorting system features a waterfall-style feeding unit that supports multi-channel...
Wuhan, China
HGTECH Wafer Thickness Measuring Series Semiconductor Wafer Thickness Measuring Equipment
- Manufacturer: Hgtech
Product advantages: Used for 4-8 inch original wafer, substrate and epitaxial wafer of various materials and polishing conditions Thickness range: 0-1mm measurement accuracy: ± 1 μ M repetition accuracy: 0.2 μ m ...
Wuhan, China
HGTECH Wafer Defect Detection Series Semiconductor Wafer Defect Detection Equipment
- Manufacturer: Hgtech
Product advantages: This equipment can be used for 4-8 inch patterned wafers Detect defects such as scratch, back collapse, color difference, crack, scratch, metal residue and metal loss System resolution: 0.2-0....
Wuhan, China
HGTECH LSF10P Corrosion Resistant Black Laser Marking Intelligent Equipment for Medical Devices
- Manufacturer: Hgtech
HGTECH LSF10P Corrosion Resistant Black Laser Marking Intelligent Equipment for Medical Devices targets the medical device industry, a low-power picosecond laser is used to form nanoscale structures on the surfac...
Wuhan, China
HGTECH Laser Scribing Series Nanosecond Laser Scribing Equipment
- Manufacturer: Hgtech
Product advantages: The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, includ...
Wuhan, China
HGTECH Wafer Slotting Series Wafer Laser Slotting Equipment
- Manufacturer: Hgtech
Product advantages: Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position Based on spatial light mo...
Wuhan, China
HGTECH Wafer Marking Series Wafer Laser Marking Equipment
- Manufacturer: Hgtech
Product advantages: Special robot for wafer automatic picking and placing, automatic focusing With different light sources, it can adapt to different accuracy levels Intelligent, visual positioning + automatic ed...
Wuhan, China
HGTECH Laser Scribing Series Picosecond Laser Scribing Equipment
- Manufacturer: Hgtech
Product advantages： Cutting line width is narrow (taking ultraviolet collimation as an example, cutting line width + HAZ ≤ 20 ± 5 μ m) Small edge collapse (≤ 10 μ m） UPH ≥ 10 (UV galvanometer: take 3-inch double ...
Wuhan, China
HGTECH Wafer Marking Series Full Automatic Wafer Marking Equipment
- Manufacturer: Hgtech
Product advantages: Picosecond light source is used to mark / code on the material surface, with small thermal impact and good effect Support various formats: QRcode, dmcode, line text and other formats Equipped ...
Wuhan, China
HGTECH LSU Series UV Laser Marking Machine
- Manufacturer: Hgtech
With small UV focus spot and heat affected zone, UV laser marking machine has high absorptivity to 355nm UV-light, which is suitable for many materials. ● High-performance ultraviolet laser and superior laser bea...
Wuhan, China