HGTECH LUSD3310 Fully Automatic SiC Wafer Modification and Cutting Equipment
new
- Manufacturer: Hgtech
The Fully Automatic SiC Wafer Modification and Cutting Equipment LUSD3310 uses multiple high-precision CCD vision cameras to automatically identify and locate 6-8 inch wafers with various die specifications. Comb...
Wuhan, China
HGTECH Wafer Slotting Series Wafer Laser Slotting Equipment
new
- Manufacturer: Hgtech
Product advantages: Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position Based on spatial light mo...
Wuhan, China
HGTECH Laser Scribing Series Nanosecond Laser Scribing Equipment
new
- Manufacturer: Hgtech
Product advantages: The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, includ...
Wuhan, China
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