SBT ultrasonic pre-sintering solidification machine SDB-300 in Shanghai, China
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Specifications
- Condition
- new
- Placement accuracy
- ±10μm@3σ (hot pressing/ultrasonic solidification)
- Uph
- 1.32Sec (Standard, pick & place)
- Mounting area
- 300mm(x)*220mm(y)*60(z)
- R-axis rotation angle
- 360°, repeatability = 0.015°
- Cold application pressure
- 10~2000gf
- Hot pressing/ultrasonic solidification
- 2~300N
- Mounting head type
- Ultrasonic mounting head (vacuum nozzle)
- Preheating temperature
- BH max. 300°C; Stage max. 200°C
- Timing
- ≤50ms
- Feeding method
- Modular flexible configuration of wafer/waffle pack/tape feeder
- Category
- PCB Assembly in China
- Subcategory
- Semiconductor equipment
- Listing ID
- 104318759
Description
Applications
Silver sintered pre-bonding (pre-labeling), DTS, Clip
Equipment Advantages
Silver sintered chip pre-placement (pre-sintering)
Supports fixed-point pick & place for SiC wafer supply.
UPH increased by more than 50% compared to normal pre-lamination
Self-supply of core ultrasonic components such as transducers