SBT Fully Automated Wafer Ultrasonic Scanning Microscope in Shanghai, China
New
Doubleclick to zoom in
Contact the seller for
additional photos and information.
Specifications
- Condition
- new
- Equipment size
- 2500㎜(L)×2000㎜(W)×1300㎜(H)
- Probe configuration
- 2 probe, 4 probe, zonal scanning
- Image resolution
- 1~4000μm
- Ultrasound transmitter-receiver bandwidth
- 1-500MHz
- Scan mode
- High-precision scanning, fast scanning (interlaced differential scanning)
- Three-axis platform
- Marble platform
- Xy-axis
- Linear motor, gantry dual drive
- Fixture (machining)
- Wafer-specific carriers
- Input and output
- fully automated
- Bonding wafer thickness
- 60-3000μm
- Cleanliness
- a hundred steps
- Category
- Microscopes in China
- Subcategory
- Ultrasonic scanning microscope for wafer bonding
- Listing ID
- 104318765
Description
Scope of Application
Suitable for 6, 8, 12-inch wafer bonding inspection
Equipment Advantages
Loadport can be interfaced with standard Cassette etc.
Wafer-specific Robot for sampling, barcode reading, and sample insertion
Four-probe cooperative wafer fast ultra-scan inspection
Aligner wafer calibration, edge finding
Wafer blow drying, put back to the original sample slot
Scanning results automatically combined, image processing, defect display, data logging
Standard communication software for wafer factories, can work with other production equipment.