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Amat HDP Specifications

Specifications

Process typeHigh Density Plasma Chemical Vapor Deposition
Supported wafer sizes200 mm, 300 mm
Primary applicationDielectric gap-fill and oxide deposition
Compatible materialsSilicon oxide (TEOS-derived oxides)
The above specifications are based on the 1995 model year.

Amat HDP description

The Amat HDP is a high-density plasma deposition platform designed for advanced PCB and microelectronic dielectric processing. Built for repeatable gap-fill and conformal oxide films, the Amat HDP combines process control and chamber stability to meet demanding production and R&D requirements. It is widely used where high-quality dielectric films and excellent step coverage are required.

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