- Trusted Seller
Bree, Ireland - Trusted SellerBree, Ireland
- Trusted Seller
Seoul, South Korea - Trusted Seller
2003 Shinkawa SFB-200
used
- Manufacturer: Shinkawa
- Model: SFB-200
De-installed, Warehoused, Can be inspected
Seoul, South Korea - Trusted Seller
Asia - Trusted Seller
TDK AFM-15 Flip Chip Bonder
used
- Manufacturer: TDK
TDK AFM-15 Flip Chip Bonder Machine is in excellent condition It was only used in R& D
Asia 2004 Panasonic FCX501-L
used
- Manufacturer: Panasonic
- Model: FCX501-L
US specification Please inquire for details.
Kawaguchi, Japan2004 Panasonic FCX501-L
used
- Manufacturer: Panasonic
- Model: FCX501-L
US specification Please inquire for details.
Kawaguchi, JapanAutomatic Wire and Chip Bonding Machine Made in China Card Antenna Machine
new
- Manufacturer: JINGUAN
Product Description Automatic Wire and Chip Bonding Machine made in China Card Antenna Machine Model NO JGBM-2000+ overall Dimension L1400 *W1200 *H1800mm Machine weight About 850kgs Electricity input AC 220V/50-...
Guangdong, ChinaDatacon 92000320076-4 BESI Bond Head Flip Chip Bonder
used
- Manufacturer: Datacon
“Used. In good condition.” Datacon 92000320076-4 BESI Bond Head Used. In good condition. #10229
$552 USDVratsa, BulgariaDatacon 95022141311 BESI Bond Head Flip Chip Bonder 92000320051
used
- Manufacturer: Datacon
“Used. In good condition.” Datacon 95022141311 Bond Head 92000320051 Used. In good condition. #10222
$552 USDVratsa, BulgariaDatacon 92000320076-4 BESI Bond Head Flip Chip Bonder
used
- Manufacturer: Datacon
“Used. In good condition.” Datacon 92000320076-4 BESI Bond Head Used. In good condition. #10227
$552 USDVratsa, BulgariaDatacon 95022141311 BESI Bond Head Flip Chip Bonder 92000320076-2
used
- Manufacturer: Datacon
“Used. In good condition.” Datacon 95022141311 BESI Bond Head 92000320076-2 Used. In good condition. #10219
$552 USDVratsa, Bulgaria
2014 Shibuya, DB250, Flip Chip Bonder
used
- Manufacturer: Shibuya
240x100mm, Wafer 12" - CONDITION: As-is Equipment detail: Flip Chip Bonder | Description: 240x100mm, Wafer 12"
Suwon-si, South Korea
PANASONIC NM-SB50A Flip Chip Bonder
used
- Manufacturer: Panasonic
Panasonic NM-SB50A Flip Chip Bonder •APPLICABLE SUBSTRATE SIZE : 50 mm square to 330 x 250 mm •APPLICABLE IC SIZE : 1 mm square to 20 mm square •DRY CYCLE TIME : 1.8s/IC •BONDING ACCURACY : 3 μm/3 •IC SUPPLY...
Gyeonggi-do, South Korea
Tip: Enter manufacturer, model or keyword
