- Tokyo, Japan
LGR-Series
new
- Manufacturer: TOWA JAPAN
Enables high-precision blade cutting of lead-less device products such as QFN packages. Selectable blade cut(FMS3040-HC) or laser cut(LGR1040) depending on process and lead frame design. Combining dedicated lead ...
Kyoto, JapanDisco DAD3221 Wafer Slicing / Dicing
used
- Manufacturer: Disco
- Model: DAD3221
Good condition Disco DAD3221 Wafer Slicing / Dicings. Located in Japan and other countries. Click request price for more information.
JapanDisco DAD3240 Wafer Slicing / Dicing
used
- Manufacturer: Disco
- Model: DAD3240
Good condition Disco DAD3240 Wafer Slicing / Dicings manufactured in 2012. Located in Japan and other countries. Click request price for more information.
JapanDisco DAD3350 Wafer Slicing / Dicing
used
- Manufacturer: Disco
- Model: DAD3350
Good condition Disco DAD3350 Wafer Slicing / Dicings available between 2004 and 2011 years. Located in USA and other countries. Click request price for more information.
AsiaDisco DFD6340 Wafer Slicing / Dicing
used
- Manufacturer: Disco
- Model: DFD6340
Good condition Disco DFD6340 Wafer Slicing / Dicings available between 2005 and 2011 years. Located in USA and other countries. Click request price for more information.
AsiaDisco DFD6750 Wafer Slicing / Dicing
used
- Manufacturer: Disco
- Model: DFD6750
Good condition Disco DFD6750 Wafer Slicing / Dicings. Located in USA and other countries. Click request price for more information.
AsiaDisco DFD6240 Wafer Slicing / Dicing
used
- Manufacturer: Disco
- Model: DFD6240
Good condition Disco DFD6240 Wafer Slicing / Dicings. Located in USA and other countries. Click request price for more information.
Asia