Used Wafer Slicing / Dicing in South Korea

Okamoto ADM6D

• used

• Manufacturer: Okamoto
• Model: ADM-6D

Application: Dicing for 6 inch | Axis/block: Item | Work size: ø6" ( ø152.4mm) | X-axis: Useable stroke | Cut speed: 0.1~250 | Y-axis: Useable stroke | Indexing step: 0.001 | Z-axis: Maximum cutting stroke | Min...

Disco DFD-3D/8

• used

• Manufacturer: Disco

Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Servo Motor-Direct Drive | Minimum stroke: 652mm (25.7") (end to end) | Set-up cut stroke: 200mm (8.7") | Cut speed: 0.7~3000mm/sec (0.0028 ...

DYNATEX INTERNATIONALTM DX-III

• used

• Manufacturer: Dynatex
• Model: DX-III

Application: Scribing | Automatic: Capable of complete, automatic scribing and breaking of many substrate materials | Cost effective: - System integration allows easy hook-up and transport - Superior yield and i...

Disco Full Automatic Dual Spindles DFD 2D/8

• used

• Manufacturer: Disco

Disco DFL7160 Wafer Slicing / Dicing

• used

• Manufacturer: Disco
• Model: DFL7160

Good condition Disco DFL7160 Wafer Slicing / Dicings available between 1995 and 2012 years. Located in Ireland and other countries. Click request price for more information.

Disco DFD6340 Wafer Slicing / Dicing

• used

• Manufacturer: Disco
• Model: DFD6340

Good condition Disco DFD6340 Wafer Slicing / Dicings available between 2005 and 2011 years. Located in USA and other countries. Click request price for more information.