Used Wafer Grinding in Jiangsu, China

2004 DISCO DFG 850

• Manufacturer: Disco
• Model: DFG850

The Disco dfg850 8" back wafer grinding and thinning machine, compatible with 4-5-6" products. high efficiency.

DFG8560

• Manufacturer: SSMC

Conform to the development trend of wafer technology, realize ultra-thin and large caliber wafer processing Gather the essence of existing grinding machine Dfg8540 / 8560 is an upgrade model of dfg800 series with...

2004 DISCO DFG860

• Manufacturer: Disco
• Model: DFG860

Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning.

DISCO GNX300

• Manufacturer: Disco

Okamoto gnx300 12 inch wafer back ultra-thin grinding and thinning equipment, with new color and high precision in 2005. The company has a professional service team to provide after-sales machine spare parts main...

2005 ACCRETECH PG200RM

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: PG200RM

DISCO DFG8540

• Manufacturer: Disco
• Model: DFG8540

Equipment name: Grinder thinning machine

OKAMOTO GNX200

• Manufacturer: Okamoto
• Model: GNX-200

2004 TSK PG300RM

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: PG300RM

Equipment name: Grinder thinning machine

1998 DISCO DFG841

• Manufacturer: Disco
• Model: DFG841

ACCRETECH PG3000/200RM

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: PG3000

ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. Features