Used Wafer Grinding

IVG-2020/3020

• new

Semi-automatic single-axis thinning machine is suitable for 2-12 inches wafers and special specification material grinding, manual loading mode, simple operation, rich features, configuration of automatic thickne...

TFG-3250

• new

This equipment is a 3-spindle, 4-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with auto-centering, transfer...

TFG-2200/3200 series

• new

This equipment is a dual spindle three-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with automatic centerin...

TGP-3350

• new

The equipment is suitable for 8-12 inches wafer thinning and polishing, all adopt air-floating spindle and air-suspended rotary table design, with automatic thickness measurement, integrated wafer calibration and...

TAP-500/600 Dual series

• new

This series of polishing machine is a high precision single-sided polishing equipment with double polishing discs, which can realize four-axis simultaneous processing, and the equipment can be configured accordin...

TDL-600/1200

• new

This series of double-sided grinding machine is a high-precision, high-stability grinding and processing equipment, with the upper disc, lower disc, inner ring active drive, can be customized according to custome...

TAP-400/450/500/600 series

• new

This series of polishing machine is a double-axis high-precision single-sided polishing equipment, equipment can be configured according to different wafers with the corresponding polishing head, vacuum adsorptio...

TSG-200A

• new

The machine is a double spindle, double table, through the diamond grinding wheel, the resin material will be processed by the creep-feed grinding method, with automatic thickness measurement, multi-stage grindin...

TSP-610/810/910/1270/1500 series

• new

This series of polishing machine is a ceramic disk as a carrier, through the paste wax or no wax adsorption way to fix the wafer for polishing of high-precision single-sided polishing equipment, dual-axis, four-a...

TMP-200S

• new

This series of equipment is suitable for CMP polishing equipment for thin films (dielectric layers), including oxide, metal, STI, SOI, MEMS and other products of planarization polishing. It adopts multi-partition...

TSP-380

• new

The equipment is desktop high-precision single-side polishing equipment, the equipment occupies a small area, easy to operate, can be matched with copper disk, tin disk, glass disk, stainless steel disk, etc., wi...

TDP-1200/1204/1500 series

• new

This series of double-sided polishing machine adopts the upper polishing disc can be swung out of the design, airbag pressure way, with different polishing pads, polishing liquid can realize the double-sided poli...

Manual Grinder

• new

Manual grinder: Easy to operate, low energy consumption and Low noise and easy to clean and maintenance.

Okamoto GNX300 Wafer grinder 12" GNX300

• used

• Manufacturer: Okamoto
• Model: GNX-300

BLOMBACH AK120-475R-200318, S5--E120F475A, Grinding spindle

• used

• Manufacturer: BLOMBACH

BLOMBACH GmbH Grinding spindle, AK120 475R 200318, S5 E120F475A Model: AK120475R200318 Torque n=5000/1012 Total length=670mm,Ø120mm Length of the cone part with flange ring=100mm with thread=90mm

Okamoto SVG-502 Wafer Grinding

• used

• Manufacturer: Okamoto
• Model: SVG-502

Good condition Okamoto SVG-502 Wafer Grinding manufactured in 1995. Located in Ireland and other countries. Click request price for more information.