Used Wafer Grinding

BLOMBACH AK120-475L-200099, S5--E120F475B, Grinding spindle

• used

• Manufacturer: BLOMBACH

BLOMBACH GmbH Grinding spindle, AK120 475L 200099, S5 E120F475B Model: AK120475L200099 Torque n=5000/1004 Total length=670mm,Ø120mm Length of the cone part with flange ring=100mm with thread=90mm

Mechanical spindle wafer grinder

• new

Main purpose of the equipment: Mainly used for thinning and grinding of hard and brittle materials such as sapphires, semiconductors,ceramics, quartz crvstals, and circuit poard packaging ) The equipment adopts a...

DS Precision Ind. Co. DS-Precision

• used

• Manufacturer: DS Precision Ind. Co.

Application: Lapping/Polishing various wafers | - table motion: Rotational Motion | - stable repeatability: less than 5% | - work clamp: Rotation Guide | - workpiece: Max 6" | - table size: 380mm | - slurry spra...

Air spindle full automatic wafer grinder

• new

□ Fully automatic wafer back thinning □ Grindable wafer size4 “/5”/6”/8” □ Two axis three disc mode □ Online thickness measurement □ Wafer cleaning and drying □ Dry in,dry out standard 2 air spindle + 3 mechanica...

Air spindle semi automatic wafer grinder

• new

□ Semi automatic single axis wafer back thinning □ Grindable wafer size 4-8 " □ Single axis single disc mode □ Online thickness measurement □ Corresponding to irregular specifications MDXZ-G300HG □ Semi automatic...

Peter Wolters AC-1500P, DSP(Double Sided Polisher)

• used

• Manufacturer: Peter Wolters

Model: AC-1500P Maker: Peter Wolters Vintage: 2007 Condition: Working Wafer size:300mm

DISCO GNX300

• used

• Manufacturer: Disco

Okamoto gnx300 12 inch wafer back ultra-thin grinding and thinning equipment, with new color and high precision in 2005. The company has a professional service team to provide after-sales machine spare parts main...

2004 DISCO DFG 850

• used

• Manufacturer: Disco
• Model: DFG 850

The Disco dfg850 8" back wafer grinding and thinning machine, compatible with 4-5-6" products. high efficiency.

DFG8560

• used

• Manufacturer: SSMC

Conform to the development trend of wafer technology, realize ultra-thin and large caliber wafer processing Gather the essence of existing grinding machine Dfg8540 / 8560 is an upgrade model of dfg800 series with...

2004 DISCO DFG860

• used

• Manufacturer: Disco
• Model: DFG860

Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning.

1996 DISCO DAD2H6T

• used

• Manufacturer: Disco
• Model: DAD2H6T

The Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafers. The company has a professional after-sales team to provide relevant installation, commissioning and maintenan...

OKAMOTO GNX200

• used

• Manufacturer: Okamoto
• Model: GNX-200

2004 TSK PG300RM

• used

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: PG300RM

Equipment name: Grinder thinning machine

SGM-450V

• new

SGM-450V Semiconductor industry, electronic connector industry, ceramic industry, tungsten steel industry, precision and high precision parts processing industry, precision mold industry, etc.

ACCRETECH PG3000/200RM

• used

• Manufacturer: Accretech - Tokyo Seimitsu - TSK

ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. Features

Okamoto VG-502 Wafer Grinding

• used

• Manufacturer: Okamoto
• Model: VG-502

Good condition Okamoto VG-502 Wafer Grinding manufactured in 1995. Located in USA and other countries. Click request price for more information.