
Royce Instruments DE35i-6 pick and place for wafers up to 150mm
- Manufacturer: Royce Instruments
- Model: DE 35
Royce DE35i-6 semiautomatic pick and placeconfigured with clamping device for wafers up to 150mm vacuum pickup of die from film mounted wafers and places into waffle packsminimum die size 0.008" squareOptem zoom ...

Royce Instruments DE 35 Die Bonder
- Manufacturer: Royce Instruments
- Model: DE 35
Good condition Royce Instruments DE 35 Die Bonders. Located in USA and other countries. Click request price for more information.
USA

